含硬夹杂软材料的力学行为研究

应用理论分析、数值模拟以及实验的方法，研究含硬夹杂软材料的力学失效问题。研究内容包括：分别在小变形和大变形的条件下，研究软材料内的任意形状夹杂问题、刚性线夹杂问题、椭圆夹杂热应力问题，以及电极-柔性基体夹层结构的电击穿问题等。创新点有：首次提出“刚性线”是软材料中的关键缺陷，就如同“裂纹”是硬材料内的关键缺陷一样，从而拓展了软材料断裂问题的研究方向；针对任意形状夹杂、椭圆夹杂和刚性线夹杂问题的研究，发展了软材料力学问题的经典解。通过本项目的研究，旨在揭示含夹杂软材料的破坏失效机理，促进软材料力学理论的发展，并为柔性电子器件的结构优化设计和寿命预测奠定理论基础。

The failure behaviors of soft materials with hard inclusions will be investigated by theoretical analyses, simulations and experiments in this project. The studies involve soft materials with arbitrary hard inclusions (or rigid line), thermal stress analysis for soft materials with ellipse inclusion and the electric breakdown problem for layered structure of hard and soft materials. Small and large deformation conditions will be employed, respectively. The main innovations include: The “rigid line” is first time proposed as the critical defect in soft materials such as crack in hard materials, which expand the direction of the research; Develop the theoretical solutions to fracture behaviors of arbitrary inclusions, ellipse inclusions and rigid line in soft materials, respectively. The main purposes of this project are to reveal the fracture mechanism of soft materials with hard inclusions and promote the development of mechanics of soft materials. The results have the potentials to serve as theoretical basis for structure optimization designs and life predictions of stretchable electronics.