随着电子器件的微小化和集成化，散热问题已成为影响电子器件性能和稳定性的瓶颈。研发具有高导热性能的聚合物复合材料是解决电子器件散热的重要手段。大量研究表明，填料与聚合物基体之间较大的界面热阻是制约其导热性能提升的障碍。但是，由于目前相关的测量技术无法精准获得填料与基体之间的界面热阻，造成对其界面热传导机理的理解不够深入、界面热阻调控能力有限。本项目以氮化硼纳米片/环氧树脂为研究对象，开展如下研究：（1）通过表面修饰调控氮化硼纳米片表面官能团，并与环氧树脂复合，制备出不同界面特性的氮化硼纳米片/环氧树脂复合材料；（2）采用新型的电子束自加热系统，直接测量具有空间分辨率氮化硼纳米片/环氧树脂之间的界面热阻，确立氮化硼纳米片/环氧树脂界面特性与界面热阻之间的定量关系；（3）采用有限元分析技术，构建氮化硼纳米片/环氧树脂导热模型，为高导热聚合物复合材料在微电子、电子信息等中的应用提供理论和实验依据。

With the miniaturization and integration of electronic devices, heat dissipation has become a bottleneck that affects the performance and stability of electronic devices. The development of polymer composite materials with high thermal conductivity is an important way to solve the heat dissipation of electronic devices. A large number of studies have shown that the large interface thermal resistance between the filler and the polymer matrix is an obstacle restricting the improvement of its thermal conductivity. However, due to the fact that the related measurement technology cannot accurately obtain the interface thermal resistance between the filler and the matrix, the understanding of the interface thermal conduction mechanism is not deep enough, and the ability to adjust the interface thermal resistance is limited. This project takes boron nitride nanosheets / epoxy resin as the research object, and carries out the following research: (1) The surface functional groups of boron nitride nanosheets are adjusted by surface modification and compounded with epoxy resin to prepare boron nitride nanosheet / epoxy composite material with different interface characteristics; (2) A new type of electron beam heating system is used to directly measure the thermal resistance of the interface between the boron nitride nanosheet / epoxy resin with spatial resolution to establish the quantitative relationship between the interface characteristics of boron nitride nanosheet / epoxy resin and the interface thermal resistance; (3) Using finite element method to build the boron nitride nanosheets / epoxy resin thermal conduction model. This project will provide the theoretical and experimental basis for the application of a high thermal conductivity polymer composite material in microelectronics, electronic Information area.