对电路动态可靠性的分析及其设计是当前的研究热点。在现有的电路可靠性方法中，作为冗余的硬件往往实现在系统级、电路板级或模块级，这带来硬件开销大、功耗高、设计对象的体积和重量皆偏大等弊端，因此探索在电路底层级，如寄存器传输级（RTL）、门级，实现其高可靠性的新方法，不但可克服上述弊端，而且，更符合可靠性工程的本质内涵。本项目拟首先研究数字逻辑电路在寄存器传输级、门级的动态可靠性问题，在对寄存器传输级和门级电路的动态特性的定量描述的基础上，得到其动态可靠性的测度、模型和分析方法，以此作为其可靠性实现的理论基础，随后研究利用多值逻辑在寄存器传输级、门级实现低硬件开销的逻辑容错方法，进一步，探索出借助多值逻辑和动态重构，对数字逻辑电路在寄存器传输级和门级实现逻辑和互连的在线故障自修复的方法。统计物理中关于信息熵的理论和当代高密度集成器件的新进展分别为本项目提供了原理和实现方法上的可行性。

The analysis and the design for dynamic reliability of circuits are hot topic in the circuit reliability field.For circuit reliability solution adopted currently,hardwares used as redundancy are mostly implemented at the level of the system,the board or the module.These treatment methods give rise to several disadvantages,such as high harware overhead,high power consumption,oversize volume and overlarge weight of the design ,and so on.As a result,obtaining novel methodology on higier circuit reliability at the bottom level of circuit implementation,for example,register transfer level and gate level,is of great importance.This solution can not only overcome those drawbacks above mentioned,but also conform to the essential requirement of reliability design of circuits.Firstly,This project will research dynamic reliability problem of digital logic circuit at register transfer level and gate level and dynamic characteristics at register transfer level and gate level of digital logic circuits can be described.Accordingly,the messure,the model and correspongding analysis method of dynamic reliability can also be acquired.Results outlined above are the theoretical basis of reliability relization in this project.Secondly,by multiple valued logic, the logic tolerance with lower hardware overhead at register transfer level and gate level is investigated.Finally, in this project,on-line fault self-repair/self-recovery of the logic and interconnection at register transfer level and gate level of digital logic circuit will be researched with the help of multiple valued logic and dynamic reconfiguration.Theory on information entropy in stastical physics provides principle practicability and up-to-date progress of integrated devices with high density provides implementation practicability for approaches presented in this project,respectively.