目前二维平面加工方法已接近器件制备的物理极限，三维加工方法将成为一个新的发展途径并受到广泛重视，但如何实现三维空间可控加工和三维结构功能化应用以及弄清其加工机制，仍是具有极大挑战性的课题。本项目针对当前三维加工的问题，引入三维“组装”加工的概念，依据在外场作用下纳米薄膜的应变效应，将纳米薄膜的二维微纳结构通过有序折叠或卷曲方式进行三维组装加工，从而实现各种三维微纳结构的按需构筑，其空间取向可调、结构多样可控的特点非常利于多种薄膜的三维功能化应用。本项目拟建立新的纳米薄膜三维组装加工方法，研究大面积、高效、跨尺度的纳米薄膜三维可控组装加工的关键技术与工艺，重点研究薄膜种类、组合、膜厚、尺度等因素在外场诱导作用下对组装加工的影响及构效关系，揭示三维应变加工机制及多场作用的物理过程，探究三维组装微纳光学结构的光学调控新特性和新响应模式及耦合机制，探索其高灵敏度光学探测及高性能宽带滤波等器件应用。

Now 2D planar processing method is close to the physical extreme limit of nanodevice fabrication, and 3D fabrication method will become a new way and has received widespread attention, but how to realize controllable fabricationthe in 3D space and functional applications of 3D structure and find out its processing mechanism, is still a great challenging task. . Facing the current 3D fabrication problem, this project introduces the concept of 3D "assembly" fabrication. Based on the strain effect of nanofilm induced by external field, three-dimensional micro-nanostructure is constructed on-demand by the 3D assembly process using orderly folding or crimping for 2D micro-nanostructure of the nanofilm, having adjustable spatial orientation and controlled structural mode that are suitable for diverse 3D functional application of thin film.. This project will build new 3D-assembling fabrication method for nanofilm and research key assembly processing technology on large area, high efficiency, across-scale of 3D controllable processing for nanofilm, in which the effect of the film-type, composition, thickness, dimension and other factors on assembly processing induced by external field and structure-activity relationship are mainly studied to reveal 3D strain mechanism and multi-field induced physical process. We will explore the new optically modulation property and new optical response model with coupling mechanism for 3D-assembling micro/nanostrucutre to discover the high sensitivity applications on optical detection and high-performance broadband filtering device.