针对光学材料加工亚表面缺陷检测技术在重大产业和重大科技工程中的迫切需求，首次提出基于互补孔径整形照明原理的暗场共焦三维显微测量方法，利用相位调制整形实现同侧互补孔径探测与照明的暗场共焦成像，寻求建立一种新的具有高分辨力轴向层析特性的光学显微测量机制，该方法不仅能显著抑制光学元件抛光层直接反射光噪声，实现多缺陷关联分布的解耦合定位，而且具有三维测量分辨力高、照明效率高等优点。主要研究内容包括：1）暗场成像互补孔径照明与探测三维成像分辨力的影响规律研究；2）暗场照明整形关键技术研究；3）暗场共焦散射样品响应特性和多缺陷解耦合定位方法研究。预期关键技术指标包括：横向分辨力：0.1μm-1μm，NA：0.4-0.95；轴向分辨力：0.3μm-3μm，NA：0.4-0.95；暗场照明整形效率：70%-90%（500nm-950nm）；最大探测深度：100μm。

Subsurface defects inspection in optical materials processing is of an arising and urgent demand in some major industries and key projects of science and technology. A new kind of 3D dark-field confocal microscopy is proposed for the first time with beam shaping and ipsilateral complementary illumination and detection apertures so as to establish a novel measurement mechanism, in field of optical microscopy, with high resolution and excellent axial sectioning ability. Alongside the high 3D measuring resolution and illumination efficiency, the proposed method is also supposed to be able to inhibit the noises directly reflected by polishing layer and decouple depth positions of multiple defects. The main researches of this proposal include that: 1) Imaging rule of the dark-field confocal microscopy with complementary illumination and detection aperture, and corresponding influential factors on 3D resolution. 2) Key techniques of beam shaping for dark-field illumination. 3) Relationship between sample scattering characteristics and multiple defects localization under dark-field illumination and confocal detection. Expected key technical indicators are lateral resolution 0.1μm-1μm (NA: 0.4-0.95), axial resolution 0.3μm-3μm (NA: 0.4-0.95), dark-field illumination beam-shaping efficiency 70%-90% (500nm-950nm), maximum inspection depth 100μm.