红外面阵探测器是红外成像系统的核心部件，但热冲击下面阵探测器的碎裂问题严重制约着其适用性。针对这一问题，项目拟以128×128锑化铟面阵探测器为研究背景，采用理论分析、数值仿真和试验验证相结合方法，开展大面阵红外探测器结构建模、模型验证及其在探测器碎裂模式辨识、低碎裂结构设计优化方面的研究。建立128×128面阵探测器高保真结构分析模型，揭示热冲击下最大Von Mises应力及分布随材料各向异性和尺度效应的依赖关系，结合典型裂纹起源及分布特征，验证"先分割、后等效"这一大面阵探测器结构建模设想的正确性。针对现有典型裂纹起源于N电极区域的统计分析结果，系统研究热应力极值及分布随N电极结构参数、材料选取、布局等因素的演变规律。优化器件结构参数，进一步降低热应力，形成探测器低碎裂结构设计方案，结合热冲击试验，验证优化设计的有效性。这为大幅提升红外面阵探测器的成品率提供设计依据和实现手段。

Infrared focal plane array(IRFPA)detector is a key component of infrared imaging system, but the fracture, appearing in IRFPA detector under thermal shock test, limits its applicability for large scale equipments. Focusing on 128×128 InSb IRFPA detector,in this project, theoretical analysis, numerical simulation and experimental verification methods are all adopted, to research the large format detector structural modeling and verification method,furthermore, employing the created model, recognizing the fracture modes of IRFPA detector and optimizing its structural design. Firstly, creating the high fidelity structural analysis model of 128×128 InSb IRFPA detector, and revealing the relationship about the maximal Von Mises stress value and its distribution depending on both anisotropy and size effects of InSb chip, then basing on the typical crack originations and crack distributions appearing in the InSb chip, verifying the validity of "first division, then equivalent" modeling assumption, which is proposed in this project. Secondly, uncovering the changing tendency of the thermal stress value and distribution dependent on the structure parameters of N electrode, material selection and N electrode layout. Finally, optimizing the whole structural parameters to further reduce the thermal stress of IRFPA detector, and forming a complete low thermal stress design scheme, and combining with thermal shock test, verifying the validity of structural optimization design. All these are to provide both theoretical design rules and process schedules suitable for mass production of IRFPA detector.