TSV三维封装是极具发展前景的高集成度电子封装技术。其制备工艺与传统的平面互连封装技术有显著区别，因此如何对其内部缺陷进行检测，成为该领域研究的关键问题。本项目提出一种利用系统内集成传感器获取缺陷信息的TSV内部缺陷主动检测新方法。首先以在线工作下TSV内部缺陷响应机理研究为基础，掌握缺陷信号的输出规律；同时设计内置传感器在TSV三维封装中的集成工艺，以使缺陷信号能被检测系统采集；在工作电载荷及激光加热的复合激励下，充分激发封装内部隐藏缺陷，利用内置传感器获取缺陷信号，并对缺陷特征进行分离与识别，从而掌握在线式主动探测方法。在此基础上，集成理论、仿真和试验结果，建立自动化的三维封装缺陷测试与可靠性评估系统。本项目的研究将解决三维封装中内部缺陷难检测的问题，能推动电子制造业技术的发展，对我国相关产业抢占技术制高点具有重要意义。

TSV 3D packaging is a promising technology by which high-density and miniature packaging can be realized. The process of TSV 3D packaging, which orients to the application of small diameter, high-density and high aspect ratio, is quite different from that of traditional planar echnology because the former is based on the vertical interconnection technique. However, along with the shrinkage of processing dimension of TSV 3D packaging, the scale effect is more and more obvious. Thus it is becoming a critical problem that how to inspect the inner defects of packaging. A novel active inspection technology based on on-line thermal excitation is presented and the integrated in-system sensors in TSV packaging are applied to acquire the information of inner defects. At first, the output law of inner defects is understood based on the research of defect response mechanism under on-line thermal excitation. The integrating technique of integrated in-system sensors is designed so that the defect signals can be captured by inspection system. The laser heating and operating current are used as combined excitation to stimulate the inner defects. Integrated sensors then acquire the defect signals of which the characteristics are separated and recognized. Thus the active inspection technology based on this combined excitation is developed. And an automatic defect inspection and reliability evaluation system for 3D packaging can be established by the aid of the theoretical and experimental research. This project will solve the problem that the inner defects of 3D packaging are difficult to be inspected. And as a result, the research will promote the development of electronic manufacture technology and has prominent significance for corresponding national industry to occupy the leading position in world-wide technology competition.