针对SiCp/Al复合材料焊接中存在的SiC颗粒与铝基体间有害界面反应、表面SiC颗粒处结合弱的难题，本项目拟设计和制备一种活性纳米复合中间层，并基于该中间层采用激光诱导自蔓延连接方法实现该材料的可靠连接。利用中间层自蔓延反应放热快速、热量集中的特性控制界面化学反应，起到增强表面SiC颗粒处冶金结合、避免母材有害界面反应的作用；同时，在中间层产物内生成塑性相，利用其塑性变形缓解接头应力。本项目拟在理论计算和实验相结合的基础上，基于短时高能球磨法实现活性纳米复合中间层的优化设计和制备，阐明自蔓延反应机理及连接界面传热机制。通过对接头界面反应和微观组织分析，探索接头组织演变规律，揭示接头性能与组织变化的响应关系，阐明接头组织性能调控机制及连接机理。本项目属于焊接学科、含能材料的基础交叉领域，旨在促进SiCp/Al复合材料焊接技术的发展，也为其它新材料的焊接提供一种创新思路。

To overcome the harmful interfacial reaction between SiC particles and aluminium matrix as well as the weak bonding of SiC on the surface during the welding of SiCp/Al composites, this project plans to design and fabricate an active nanocomposite interlayer to realize the reliable joining of SiCp/Al composites using the laser-induced self-propagating high-temperature synthesis (SHS) joining method. The interfacial reaction can be controlled and the metallurgical bonding of SiC on the surface can be enhanced by the SHS reaction with rapid heat release and heat concentration characters. Harmful interfacial reaction within the base metal also can be simultaneously avoided. Plastic phase will be produced in the products, and the joint stress can be relieved through its plastic deformation. Combining theoretical calculation and experiment, this project plans to optimize and fabricate the active nanocomposite interlayer using the short-time high-energy ball milling method. The mechanism of SHS reaction and interfacial heat transfer will be clarified. The evolution regulation of joint interfacial structure will be explored by analyzing the interfacial reaction and microstructure. The response relationship of joint properties to interfacial microstructure evolution will be revealed. The regulation mechanism of joint microstructure and property, as well as the joining mechanism, will be illuminated. This project belongs to the basic cross-cutting field of welding technology and energetic materials. It aims to promote the development of SiCp/Al composites welding technology and provide an innovative idea for the welding of other new materials.