电子皮肤在可穿戴设备、智能机器人、人机协作系统等领域有广阔的应用前景。目前，电子皮肤的可靠性是制约其应用的关键问题。因此，需要构建兼具强韧性和自修复性的柔性导电水凝胶来解决电子皮肤的可靠性问题。本项目基于氢键网络结构设计和能量耗散机制将丙烯酰胺、甲基丙烯酸单体与液态金属微粒通过一步共聚合法制备高强韧自修复导电水凝胶体系。单体中的甲基保护效应使羧基和氨基形成的氢键网络具有良好的适应性以提高复合水凝胶的力学性能。研究聚合工艺对复合水凝胶组成、形态、氢键网络结构的影响规律。探讨复合水凝胶结构对其力学性能、导电性能、传感性能和自愈合性能的影响。揭示氢键对复合水凝胶力学的增强机制，为高强韧自修复导电水凝胶在柔性电子领域的应用奠定基础。

Electronic skin with flexibility and sensitivity is a promising candidate in wearable devices, smart robot and man-machine collaboration system. At present, the reliability of electronic skin is the key problem to restrict its applications. Therefore, it is necessary to construct conductive and soft materials with toughness, stiffness and self-healing property to solve the reliability problem of electronic skin. Hydrogels with good biocompatibility, flexible and self-healing property are candidate materials as electronic skin. Based on the formation of hydrogen bond network and energy dissipation mechanism, the conductive hydrogels with toughness, stiffness and self-healing property crosslinked by hydrogen bond are facilely prepared by free-radical copolymerization of acrylamide, methacrylic acid and liquid metal particles. The methyl group in monomer protects the hydrogen bond formed by carboxyl group and amino group, which makes the hydrogen bond stronger. The effects of components and process conditions on mechanical and electrical properties of conductive hydrogels are studied. The piezoresistive sensor is constructed and its sensing performance is investigated. The effects of temperature and pH on the mechanical and conductive properties of conductive hydrogels after self-healing are studied. The enhancement mechanism of hydrogen bond on hydrogels mechanics is revealed.