铜基电接触材料是低压电器用触头材料节银环保设计的重要发展方向之一，其需求的迫切性随着贵金属银资源的匮乏和银价的攀升与日俱增。铜基材料作为低压电器用电触头的最大障碍在于其氧化造成的接触状态不稳定问题。目前，解决这一问题的关键所在是调控第二相与基体之间润湿性。本项目拟针对TCO/Cu复合材料相界面润湿性对其致密化与损伤行为的影响开展研究，突破微纳米第二相原位合成工艺及材料氧化和电弧烧蚀后表面状态表征等关键技术，通过TCO相成分、形态、微观结构，以及基体合金化程度等参数变化实现相界面润湿性调控，进而研究材料相界面润湿性对致密化、氧化、电弧烧蚀等过程的影响规律，揭示界面润湿性对TCO/Cu复合材料制备和服役过程中物理化学反应的影响机制，为高性能铜基低压电接触材料设计原则的完善奠定理论基础。

Copper-based electrical contact materials represent promising trend in developing silver-saving and environment-friendly electrical contact materials. The practical demanding for such materials increases with the consumption of limited silver source and its consecutively increasing price. The primary drawback that blocking the application of copper-based materials in low-voltage electrical contacts is the contact instability due to oxidization. The keypoint is to solve the wettability between second phases and the matrix. This project is to investigate the effects of wettability of TCO/Cu composites on the materials synthesis and its performance. The in-situ synthesis technique of micro/nano structures second phase will be optimized, and the surface states of composites after are erosion will be characterized. The interface wettability is to be tuned through the control of phase components, morphology and structure of TCO phase, as well as the alloying of matrix. The influence of interface wettability on the densification, oxidization and arc erosion of contact materials will be studied. The correlation between interface wettability and materials fabrication and physic-chemical reactions under practical operation is to be explored, which should be crucial for the design of high-performance copper-based low-voltage electrical contact materials.