以ACA倒装键合界面连接强度为研究对象，从键合互连界面的设计、制造和使用角度出发，系统研究互连结构、材料、制造工艺、使用环境等因素对键合界面连接强度的作用机理，揭示各影响因素对键合界面连接强度的影响规律。通过理论建模与仿真分析，建立倒装键合界面残余应力模型。研究键合工艺参数对界面连接强度的影响，对ACA胶体固化动力学进行深入分析，建立键合工艺参数与胶体固化度之间的关系模型，研究不同固化度对界面连接强度的影响规律。基于实验—仿真—理论相结合的界面连接强度退化研究方法，研究键合界面连接强度在不同的湿热环境中的退化规律，揭示键合界面连接强度在不同湿热环境下的退化机理，建立界面连接强度S与湿热环境因子温度（T）、湿度（RH）和老化时间（t）之间的退化关系模型。综合考虑互连结构、材料、工艺、使用环境对键合互连界面连接强度的影响规律，提出一种基于设计—制造—使用环节的键合界面连接强度增强优化策略。

This project focuses on the bonding interfacial strength of the ACA flip-chip. From a designing-manufacturing-using perspective of the bonding interface, a comprehensive research will be carried on the influences of joint structure, material parameter, bonding process and service environment on the interface strength. The residual stress of bonding interface will be studied by theoretical modeling and simulation analysis. The interface residual stress model will be established. The effect of process parameters on the bonding interface strength will be investigated. The curing kinetics of ACA will be studied in-depth to establish the relationship between process parameters and curing degree. The influence of curing degree on the interfacial strength will be studied. Based on the comprehensive methodology of combining experiment, simulation and theory, the interfacial strength degradation laws and mechanism under different hygrothermal conditions will be revealed. Considering the influence of joint structure, material, process and environment, an strength enhancing optimization strategy will be proposed, which based on the designing-manufacturing-using perspective of ACA bonding interface.