本项目根植于研究微波及以上频段的RF MEMS电磁兼容性能的需要，以提高RF MEMS的可靠性并优化其设计为目标，从RF MEMS器件物理结构的多样性出发，建立内部的电磁拓扑，提取3D结构中的关键层次，分析RF MEMS 电磁干扰问题产生的机理和表现规律，获得抑制RF MEMS 3D结构的电磁干扰的方法；在现代计算电磁学理论的指导下，利用高性能VEMC云计算平台，将高性能的增强混合电磁数值计算方法运用在可动部件、平面传输线、多层薄膜、多层介质、孔、凹槽等基本关键层次的电磁建模中；建立电磁EDA软件中可调用的、包含EM性能参数的系列器件模型库；建立计算机仿真与电磁测试验证相结合的方法。项目的研究内容不仅能够实现微纳尺寸下MEMS 3D复杂结构的电磁场可视化分析，而且为3D MEMS电磁-机械-材料的协同设计与优化设计提供有效依据。本项目的研究对促进我国RF MEMS产业有积极意义。

This project is driven by the needs of electromagnetic compatibility of 3D RF MEMS devices working within microwave band and above. It aims at optimizing design and improving reliability of RF MEMS devices. Starting from their diversities of physical structure and discontinuities of electromagnetic wave propagation, internal electromagnetic topology will be established to analyze mechanism and pattern of electromagnetic interference problems for RF MEMS devices and summarize a methodology to suppress electromagnetic interference of RF MEMS devices in 3D structure. Under the guidance of modern computational electromagnetic theory and use of high-performance VEMC cloud computing platform, an advanced numerical method of enhanced hybrid computational electromagnetics will be applied in the critical basic level of electromagnetic modelling on moving parts, planar transmission line, multilayer film, multilayer medium, holes, grooves, etc, to establish a series of 3D RF MEMS device model libraries with EM performance parameters that can be imported by electromagnetic EDA software. Also, a combined method of computer simulation and test verification can be delivered. To conclude, this research project can not only realize 3D electromagnetic visual analysis of complex structure MEMS at the size of micro-nano, but also provide an effective basis for synergy and optimization of 3D MEMS electromagnetic, mechanical and materials design. Research on this project also has a positive meaning for the promotion of Chinese RFMEMS industry.