针对用于电子设备高热流密度散热的环路热管性能需求及成本制约因素，本项目重点围绕环路热管的核心元器件毛细芯展开研究，提出多基材不同尺度的复合结构多孔毛细芯。主要研究包括：复合毛细芯微米尺度多孔主体结构成形、管壁与复合毛细芯的一体化制备、复合多孔结构微观固相烧结机理、毛细芯基体表面次级纳米尺度微结构成形机理、复合毛细芯微米尺度多孔主体结构及纳米次级微结构的数字化表征、复合毛细芯传热传质性能研究、微米级主结构及纳米次级结构参数对毛细芯性能的影响机制。最终构成一套完整的高性能多尺度微纳结构符合多孔毛细芯制造理论体系及加工方法，为我国在高热流密度电子芯片散热领域提供具有自主知识产权的技术支撑。

According to the performance demand and high cost of loop heat pipes for the thermal control of electronic equipments with high heat flux, this project focuses on the core components of loop heat pipe and presents a composite porous wick with nano surface structure. The main research works include: formation of micrometer-scale main structure of composite porous wick, integrated fabrication of evaporator and wick, solid phase sintering mechanism of composite porous structure, forming mechanism of nano surface structure on the wick structure, design and digital characterization of micrometer-scale main structure and nano-scale surface structure, study on heat and mass transfer performance of composite porous wick, influence mechanism of micrometer-scale and nanometer-scale structure parameters on the performance of composite wick. Finally to establish core technology and product with independent intellectual property rights for the high heat flux microelectronic chip cooling in China.