新型非晶碳基薄膜压阻材料与MEMS器件关键技术

传统硅基MEMS传感器制造工艺简单，线性度好，但压阻系数低、基体适用窄，应用受限。非晶碳基薄膜机械防护性能优异、压阻系数大、低温大面积制备能和MEMS技术兼容，作为新型碳基压阻材料，备受关注。然而因碳基薄膜体系多样、键态表征复杂，有关压阻机理不明。本项目基于材料设计制备与器件结构优化的研究思路，重点选择无氢a-C、含氢a-C:H、金属掺杂a-C:Me的三类碳基薄膜为对象，聚焦非晶碳基薄膜压阻材料与MEMS传感器关键技术展开研究，旨在建立复合PVD非晶碳基薄膜材料的设计制备方法，结合微结构演变揭示压阻机理，通过敏感结构、电路电极、加工技术等仿真优化，明确非晶碳膜MEMS压阻器件的设计理论和工作原理，结合膜基表/界面匹配控制，发展兼具高灵敏度、微型化、批量稳定的高性能非晶碳基薄膜MEMS器件关键技术，相关结果不仅助于深入理解碳基压阻材料基础理论，且为发展空天、海洋用新一代传感器奠定重要基础。

With the development of aerospace, ocean, intelligent manufacturing and other high-tech industries, traditional silicon-based piezoresistive sensors can not meet the performance requirements under some harsh environments. Due to their excellent protective property, high piezoresistive sensitivity and good compatibility with silicon-based MEMS technology, study on amorphous carbon based piezoresistive materials and MEMS devices has become a hot spot, both at home and abroad, which can also promote the MEMS industry of Zhejiang Province. Till now, the piezoresistive mechanism of amorphous carbon based films is unclear, and integration of amorphous carbon based MEMS device still face many technical challenges. In this project, according to the different bonding characteristics between metallic atom with carbon, hydrogen-free, hydrogen-containing, and Ti (bonding), Cr (non-bonding), Cu (anti-bonding), Al (ion-bonding) doped amorphous carbon films were selected, by systematically investigating their microstructure and piezoresistive behaviors, related piezoresistive mechanism can be clarified. In addition, the design, processing, packaging and power supply of the amorphous carbon based MEMS device will be systematically investigated, and the integration technology of amorphous carbon based MEMS device can be obtained, the application of the amorphous carbon based MEMS device will be carried out under harsh conditions such as sea water, high and low temperatures. This project will help to understand the basic theory of amorphous carbon based films, and promote their application in intelligent manufacturing, aerospace, marine and other fields.