微纳米尺度下超灵敏的微机械和微机电系统（MEMS）中的阻尼减振是保证其精度和安全可靠性的关键。Ti-Ni-Cu形状记忆合金薄膜在外力或交变载荷作用下发生应力诱发马氏体相变，吸收能量，应用前景广阔。本项目拟采用磁控溅射方法制备Ti-Ni-Cu合金薄膜，通过调节化学成分和晶化工艺，获得不同类型、形状、尺寸和分布的纳米析出相，在Ti-Ni-Cu形状记忆合金薄膜中同时获得高强度和高阻尼性能。系统研究纳米析出相对应力诱发马氏体相变、组织结构、界面结构及界面运动、超弹性行为和阻尼特性的影响规律；阐明交变载荷作用下纳米相对薄膜应变滞后于应力周期性变化以及弹性势能衰减的影响规律，揭示纳米析出相对Ti-Ni-Cu合金薄膜阻尼减振影响的微观机理，为微纳米尺度下的阻尼减振奠定理论基础。

The damping and passive vibration control in the micrometer or nanometer scale are the keys to get safer and more reliable ultrasensitive micro-mechine and Micro-Electro-Mechanical System(MEMS). Ti-Ni-Cu shape memory alloy thin films are considered to be the one of the most promosing materials in this field because the stress-induced martensitic transformaiton takes place during the external stress. In this proposal, we try to adjust the damping properties by nanoscale precipitates in Ti-Ni-Cu alloy thin films in order to achieve high strength and high damping properties. Ti-Ni-Cu thin films will be prepared by magnetron sputtering. The nanoscale precipitates with the different types, shapes, size and distribution can be obtained by changing the chemical compositions and the crystallization treatment parameters. The effects of nanoscale precipitates on stress-induced martensitic transformation, microstructure, interface structure and interface movement, superelasticity behaviors and damping properties will be systematically studied. The principles and mechanisms of the influences of nanoscale precipitates on damping properties will be clarfied. The relationship among the characteristics of nanoscale precipitates, stress-induced martenstic transformation and damping will be set up. The micro-mechanism of damping vibraion attenuation of Ti-Ni-Cu alloy thin films containing nanoscale precipitates will be clarified. These studies will be benefical to the damping vibration attenuation in micro-machines and MEMS.