本项目针对飞切KDP晶体亚表面损伤层去除困难的问题，提出了一种无水、无应力、无新损伤引入的化学抛光新思路：设计一种化学抛光微反应器——无水微乳液核壳结构，一方面基于内相分子在界面膜内外短程可控的“进出模式”实现KDP晶体的化学反应去除，另一方面通过核壳结构界面膜活性和尺寸调控实现无应力高点选择去除（架空效应）。前期基于油包有机酸-离子液体微乳液的化学抛光结果初步验证了上述思路的可行性，KDP晶体经新方法抛光后亚表面损伤层明显去除，且表面去除具有高点选择性，同时无明显新损伤引入。为进一步优化新抛光方法的效果，本项目拟研究无水微乳液核壳结构的界面膜活性和尺寸调控方法，探明其与KDP晶体表面的微观作用机理及高点选择性去除的内在联系，掌握抛光后表面残留物质的组成及其无损伤去除方法。研究成果将为KDP晶体亚表面损伤层的去除提供一种有益的新研究思路，也对传统化学抛光方法拓展选择性去除功能具有借鉴作用。

In this project, a new idea of chemical polishing without water, stress and new damage is put forward to solve the problem of removing the subsurface damage layer of KDP crystal by single point diamond flying cutting. A micro-reactor for chemical polishing, the core-shell structure of anhydrous microemulsion, is designed. On the one hand, the chemical removal of KDP crystal is achieved based on the short and controllable "in and out mode" inside and outside the boundary film. On the other hand, selective removal of high points can be achieved by adjusting activity of the boundary film and size of the core-shell structure (size overhead effect). The feasibility of chemical polishing driven by core-shell structure of anhydrous microemulsion was verified by previous research results. The results of polishing experiments show that the new polishing method has obvious high point selectivity, and can remove the subsurface damage layer obviously without introducing new damage. To further optimize the polishing effect, this project aims to develop a method for regulation the boundary film activity and size of core-shell structure of anhydrous microemulsion, to explore its intrinsic relationship with the microscopic mechanism of KDP crystal surface and the selective removal of high points, and master the composition of the residual material on the polished surface and its non-destructive removal method. The research results will provide a useful research idea for the removal of subsurface damage layer of KDP crystal, and also provide a reference for the traditional chemical polishing methods to expand the selective removal function.