铜合金是聚变堆偏滤器热沉材料的首选，但Cu合金存在高温强度不足、热膨胀系数过高等问题，不能满足未来聚变堆的要求。目前研究的Cu-W合金均添加高体积分数W，虽然能够有效提高高温强度，但同时也较明显降低了热导率。针对这一问题，本项目将基于W与Cu的不相溶特性，以纳米尺度W颗粒和纯Cu板为原材料，通过正交累积叠轧焊方法和退火处理，优化工艺参数，制备出低体积分数纳米W颗粒均匀分散的Cu-W合金块体材料，在保持高热导率的同时，提高合金中高温强度。研究材料的微结构和W颗粒分布随轧制道次和热处理参数的演化规律。表征Cu-W合金的硬度、抗拉强度和延伸率等室温和高温力学性能、热导率和热膨胀系数等热学性能、和抗高热负荷冲击性能，结合计算机模拟研究和微结构分析技术，阐明W颗粒尺寸减小后Cu-W基材料力学性能优化和高热稳定性机理。项目研究成果将为高性能Cu基热沉材料的研发及其在未来聚变堆中的应用提供科学依据。

Copper alloys are the first choice of heat sink materials applicable in divertors of a fusion reactor. However, the low high-temperature strength and high thermal expansion coefficient of the classical copper alloys limits such application in a future fusion reactor. Although addition of high volume ratio of W particles or fibers can effectively enhance the high-temperature strength of Cu-W composites, but simultaneously decreases the thermal conductivity. Therefore, basing on the immiscibility between Cu and W, this project will prepare the Cu-W alloys with homogeneous dispersion of low volume ratio of nanoscale W particles from the raw materials of nanoscale W particles and pure Cu thin plates by using the cross accumulative roll bonding (CARB) and annealing methods, to enhance the medium- and high-temperature strength while maintain the high thermal conductivity. The evolution of microstructure and distribution of W particles in Cu with the CARB runs and annealing parameters will be investigated. The room and high-temperature mechanical properties including hardness, tensile strength and elongation, thermal properties including thermal conductivity and thermal expansion coefficient, and high thermal load impact resistance of the Cu-W alloys will be characterized. Combined with the simulation studies and microstructure analysis, the mechanism of mechanical property enhancement and high thermal stability of the Cu-W alloys will be illustrated. The research results of this project can provide scientific basis for the development and the final application in future fusion reactor of high performance Cu based heat sink materials.