LED结温测试的研究是分析LED热学特性、优化热沉结构设计以及提高LED散热能力的基础。目前国际通用的结温测试方法是电学参数法，可实现大功率LED的结温热阻测试。然而在我们的实验过程中偶然发现电学参数法的结温测试结果（36.8℃）比热电偶、拉曼光谱法的测试结果（76.5℃）偏低约40℃，相对差距超过200%（以350mA下的1W蓝光LED为例），红光、绿光LED样品的测试结果均有不同程度的差异。如何快速准确的实现LED结温测试是目前LED检测领域亟需解决的最新前沿和关键问题之一。本课题拟开展如下研究：(1) 从理论和实验两方面来研究电学参数法测试结温不准确的核心因素；(2) 针对电学参数法存在的问题，提出相应的解决方法或者缩小测试差异的措施；(3) 设计热稳态下的结温测试新技术，优化测试系统，发展和完善结温测试标准；(4) 将所建立的结温测试系统应用于交流LED、高压LED等。

Investigation on thermal characteristics of light-emitting diodes (LEDs) depends on the junction temperature measurement. It is well known as the forward voltage method (FVM) widely used to test junction temperatures of LEDs. However, we have experimentally discovered a substantial discrepancy between junction temperature values obtained by FVM and confocal Raman spectroscopy (CRS) (e.g., 36.8 ℃ versus 76.5 ℃ above the ambient temperature at 25.0 ℃). How to test junction temperature rapidly and accurately has become one of hot topics in the LED field. In this project, we will focus on the following work: (a) to scrutinize the discrepancy between FVM and CRS in theoretical and experimental aspects; (b) to develop a remedy to eliminate the discrepancy; (c) establish an original, accurate, and noninvasive technique for LEDs to measure junction temperatures in the absence of transient phase; (d) to apply the new technique to alternating current LEDs and high voltage LEDs.