Structure and properties of TiSiN/Cu multilayer coatings deposited on Ti6Al4V prepared by arc ion plating
Structure and properties of TiSiN/Cu multilayer coatings deposited on Ti6Al4V prepared by arc ion plating
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Ti6Al4V电弧离子镀TiSiN/Cu多层镀层的结构与性能
DOI：
10.1016/j.surfcoat.2019.05.013
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发表时间：
2019-08
影响因子：
5.4
通讯作者：
Zhu Lihui
中科院分区：
文献类型：
--
作者：
Bai Xuebing;Li Jinlong;Zhu Lihui
采用多弧离子镀技术在Ti6 Al 4V基体上制备了TiSiN/Cu纳米多层膜。Cu的分布和扩散由Cu层和TiSiN阻挡层的设计厚度控制。研究了TiSiN/Cu多层膜的抗菌和防污性能。TiSiN/Cu多层涂层由纳米TiN和非晶Si 3 N4组成。金属铜以纳米团簇的形式存在。当铜层厚度为97.10 nm时，TiSiN/Cu涂层的抗压性能最好，其最大硬度为40.39 ± 0.77 GPa，对P的还原率分别为79.36%、66.21%和41.37%。triceratium、三角藻N.新月藻属（Closterium）和新月藻属（Atomicella）。同时，TiSiN/Cu多层膜对大肠杆菌和芽孢杆菌具有良好的抗菌性能。
The TiSiN/Cu nano-multilayer coatings were deposited on Ti6Al4V substrate by multi-arc ion plating. The distribution and diffusion of Cu were controlled by the designed thickness of Cu layer and TiSiN barrier layer. Anti-bacterial behaviors and anti-fouling properties of TiSiN/Cu multilayer coatings were investigated. The TiSiN/Cu multilayer coating consists of nano-crystalline TiN and amorphous Si3N4. The metallic copper presents as nanosize clusters. When the copper layer thickness is 97.10 nm, the TiSiN/Cu coating with the maximum hardness 40.39 ± 0.77 GPa has the best antifouling behavior with the reduction rate of 79.36%, 66.21% and 41.37% for theP. triceratium,N. closteriumandchlorella, respectively. Meanwhile, the TiSiN/Cu multilayer coatings have an excellent anti-bacterial behavior againstEscherichia coliandBacillus sp.
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