U.S.-Singapore Cooperative Research on Physical Design of VLSI Circuits

本申请申请资助美国伊利诺伊大学厄巴纳-香槟分校计算机科学系刘振林博士与新加坡国立大学信息系统与计算机科学系梁宏伟教授进行为期24个月的超大规模集成电路（VLSI）计算机辅助设计研究项目。合作者将开发设计模型，准确地描述物理设计过程的约束和要求。他们还将关注改进设计方法。他们的研究目标是解决设计问题和开发新的设计工具来处理极其复杂的VLSI电路。该研究问题虽然是理论上的，但可能对美国和新加坡的半导体行业产生有利影响。这项研究可以帮助半导体行业解决当今的设计问题，也可以为未来创造新的设计工具。Drs。刘和梁是备受尊敬的科学家，在该项目领域有成功的合作记录。该项目与“发展中国家科学项目”的目标相关，该项目旨在通过科学信息、思想、技能和技术的交流以及在互利问题上的合作，提高美国科学家和工程师与发展中国家同行之间的合作水平。

This proposal requests funds to permit Dr. C. L. Liu, Department of Computer Science, University of Illinois at Urbana-Champaign, to pursue with Professor H. W. Leong, Department of Information Systems and Computer Science, National University of Singapore, for a period of 24 months, a program of research on computer aided design of very large scale integrated circuits (VLSI). The collaborators will develop design models that accurately describe the constraints and requirements of the physical design process. They also will be concerned with improving design methodologies. Their research will be directed toward the goal of solving design problems and developing new design tools to handle the extremely complex VLSI circuits. The research problem, while theoretical in nature, may impact favorably on the semiconductor industries in the United States and Singapore. This research could assist semiconductor industries in solving today's design problems and, also, could produce new design tools for the future. Drs. Liu and Leong are highly respected scientists with a record of successful collaboration in the field of this project. This project is relevant to the objectives of the Science in Developing Countries Program which seeks to increase the level of cooperation between U.S. scientists and engineers and their counterparts in developing countries through the exchange of scientific information, ideas, skills, and techniques and through collaboration on problems of mutual benefit.