Microelectromechanical Engineering Research Program

电机、机械和化学工程系， 材料科学系和物理系将参与其中， 研究活动，以获得基本的了解 微机电设备和系统的性能，以便 能够进行实验研究。 此外，该小组将 开展研究，开发改进的加工技术， 三维微元件的制造和设计 示范微控制系统 这项研究计划是 分为三个部分： O 由以下材料制成的微部件的机械特性 半导体、金属和陶瓷，包括静电， 动态疲劳和摩擦学性能; O 改进的干法蚀刻和多层膜的开发 制造工艺和装配研究 微系统技术; O 一维位移器研究与设计 生物医学控制系统及其在探针中的应用 神经活动或作为显微外科手术的工具， 个脑袋

The Electrical, Mechanical and Chemical Engineering Departments and the Materials Science and Physics Departments will participate in this research activity to gain a fundamental understanding of the properties of microelectromechanical devices and systems so as to be able to carry out experimental research. In addition, this group will conduct research to develop improved process technology for fabrication of three dimensional microcomponents and the design of a demonstrative micro-control system. This research program is organized into three components: o mechanical characterization of micro-components made of semiconductors, metal and ceramics, including static, dynamic fatigue, and tribological properties; o development of improved dry etching and multiple layer fabrication processes and studies of assembly techniques of microsystems and; o study and design of a one dimensional displacement control system for biomedical and applications to probe neural activities or as a tool for microsurgery in the brain.