Micromechanical Deformation

这项研究的目的是开发一种 机械测试技术，能够测量机械 性能（如屈服强度和断裂韧性） 微米大小的体积。 研究包括测试的开发 装置以及微变形和断裂的发展 与本试验应用相关的机理理论。 这 分析能力应显著提高我们的能力， 分析和基本了解结构/性能 材料在新兴技术中的关系，如： 薄膜和表面改性材料;微电子学; 复合材料;界面;和环境影响，如 氢脆。

The objective of this proposed research is to develop a mechanical test technique capable of measuring the mechanical properties (such as yield strength and fracture toughness) of micron-sized volumes. Research includes development of the test device as well as development of micro deformation and fracture mechanism theory related to the application of this test. This analysis capability should markedly improve our capacity to analyze and fundamentally understand structure/property relationships for materials in such emerging technologies as: thin film and surface modified materials; microelectronics; composite materials; interfaces; and environmental effects, such as hydrogen embrittlement.