U.S.-Australia Joint Seminar on Enhanced Thermal Contact Conductance in Microelectronics; Melbourne, Australia; March 1992

该奖项将支持10名美国研究人员参加将于1992年3月在澳大利亚墨尔本举行的关于“微电子中增强的接触热传导”的联合研讨会。迈阿密大学清洁能源研究所所长T.Nejat Veziroglu博士将主持研讨会。联合主席将是密苏里大学罗拉分校的约翰·W·谢菲尔德博士和澳大利亚维多利亚州克莱顿莫纳什大学的阿瑟·威廉姆斯博士。研讨会是在美澳合作科学计划下举行的。接触热传导在许多实际应用中扮演着重要的角色，其中热传递是一个重要的操作因素。在微电子设备、旋转机械、低温流体容器、核裂变反应堆中的燃料包层界面和受气动加热的飞机结构接头中都有这样的例子。对于冷却微电子设备，大多数研究都集中在改进主动对流系统以散热，如冷却射流和直通流。然而，为薄膜应用开发的新技术为利用热导作为一种手段将热从电子系统和其他系统的“热点”中转移出去提供了机会。美国和澳大利亚的科学家和工程师在接触热传导方面进行了重要研究。本次研讨会的参与者将分享他们在这一领域的研究成果，描述各种新型表面制备技术(如在接触表面上沉积金属蒸气)以优化表面热传递行为，讨论在微电子和其他具有工业重要性的技术领域的应用，并就未来的合作研究活动提出建议，这些活动应该被证明是互惠互利的。将编写一份会议记录的一卷本报告，以便更广泛地传播研讨会上介绍的信息。

This award will support the participation of ten U.S. researchers in a joint seminar on "Enhanced Thermal Contact Conductance in Microelectronics," to be held in Melbourne, Australia, March 1992. Dr. T. Nejat Veziroglu, Director of the Clean Energy Research Institute, University of Miami, will chair the seminar. Co- chairpersons will be Dr. John W. Sheffield, University of Missouri- Rolla, and Dr. Arthur Williams, Monash University, Clayton, Victoria, Australia. The seminar takes place under the U.S.-Australia Cooperative Science Program. Thermal contact conductance plays an important role in many practical applications where heat transfer is a significant operational factor. Examples are to be found in microelectronic devices, rotating machinery, cryogenic fluid containers, the fuel-cladding interface in nuclear fission reactors, and aircraft structural joints subject to aerodynamic heating. For cooling microelectronic devices, most research has been on improving active convective systems for removing heat, such as cooling jets and through-flow. However, new technologies developed for the application of thin films offer opportunities for utilizing thermal conductance as a means of transporting heat away from "hot spots" in electronic and other systems. U.S. and Australian scientists and engineers are among those doing significant research in thermal contact conductance. Participants at this seminar will share their research results in this field, describe various novel surface preparation techniques (such as metallic vapor deposition onto contact surfaces) to optimize surface heat transfer behavior, discuss applications to microelectronics and other technological areas of industrial importance, and make recommendations regarding future cooperative research activities that should prove mutually beneficial. A one- volume report of the proceedings will be prepared that will give broader dissemination of the information presented at the seminar.