Engineering Faculty Internship: Transport Modeling for the Design and Manufacture of Thin Films

计算机和计算机制造业的竞争力 芯片取决于许多能力，包括设计能力， 分析和制造独特结构的薄膜， 制造电子设备。 运输现象，如热量和 质量传递和离子扩散和散射是关键的， 芯片质量和成本的控制。 这项研究将提高 在建模和解决方案方面的产学合作 用于离散不均匀的传输机制的方法， 多维介质（电子薄膜器件）。 一种独特的建模和分析方法，称为离散 将开发元素分析，以提高 目前的努力，整合几何，分析，设计和 制造，以提高工程效率和效益。 运输过程在制造业中发挥的重要作用 将通过积极的知识转移来突出强调 大学和工业合作者之间的机制。

Competitiveness in the manufacture of computers and computer chips depends on many capabilities including the ability to design, analyze and manufacture the uniquely structured thin films that make up electronic devices. Transport phenomenon such as heat and mass transfer and ion diffusion and scattering are critical in the control of chip quality and cost. This research will enhance industry-university collaboration on the modeling and solution methods of transport mechanisms for discretely inhomogeneous, multi-dimensional media (electronic thin-film devices). A unique modeling and analysis approach called discrete element analysis will be developed with the potential to enhance present efforts to integrate geometry, analysis, design and manufacturing to improve engineering efficiency and effectiveness. The important role played by transport processes in manufacturing will be highlighted throughout with active knowledge transfer mechanisms between the university and industrial collaborators.