Design and Prototyping of High Performance Computing Systems

该项目涉及开发一个设施， 系统的设计和原型制作， 相对于当前一代的功能和性能 系统. 通过开发设计实现性能提升 应用尖端半导体和封装的工具 通过结合制造和测试约束的技术 作为设计权衡过程的一个组成部分， 开发创新的新硬件/软件结构， 重要的系统类别。 该项目利用了预计的 半导体制造的复杂性和速度的增加 技术由于进一步减少特征尺寸和利用 MCM（多芯片模块）封装技术使系统 实现。

The project involves the development of a facility to enable the design and prototyping of systems that offer a major increase in functionality and performance relative to current generation systems. Performance increases are achieved by developing design tools that apply leading-edge semiconductor and packaging technologies by incorporating fabrication and testing constraints as an integral part of the design tradeoff process, and by developing innovative new hardware/software structures for important classes of systems. The project exploits the projected increases in both complexity and speed of semiconductor technologies due to further decreases in feature sizes and utilizes MCM (Multi-chip Module) packaging technologies to enable system realization .