Metal Matrix Composite Heat Sink with Improved Thermal Transmission

提出了一种制备具有高定向导热系数的金属基复合材料(MMC)的方法，用于电子元器件的封装材料，以促进散热。由于热管理是包装设计的关键方面之一，如果这种材料在经济上可行，则可以显著提高电子元件的寿命和性能。这种材料可能会产生重大的经济影响。所提出的方法是利用商用石墨纤维在气流和液体流场中铺展纤维，然后利用空心阴极等离子体技术在铺展纤维上均匀沉积铜或铝。如有必要，将应用薄的界面层Si或Mo，以改善附着力，并更好地转换机械或热性能。然后，涂层纤维将被编织或放置在所需的结构中，并在50%至80%的熔融温度下固化。预计所得到的材料在X和Z方向上具有高导热系数(600W/MK)。

A method is proposed to develop metal matrix composites (MMC) with high directional thermal conductivities for use in the electronic components as packaging material to promote heat dissipation. Since thermal management is one of the critical aspects of packaging design, lifetime and performance of electronic components can be increased dramatically if such a material is economically feasible. Such a material could have significant economic impact. The proposed method is to utilize commercially available graphite fibers employing fiber spreading in a pneumatic and liquid flow field, followed by uniform deposition of copper or aluminum on the spread fibers by hollow cathode plasma technique. A thin interface layer of Si or Mo will be applied if necessary, to improve adhesion and better translation of mechanical or thermal properties. The coated fibers will then be weaved or placed in desired architecture and consolidated at 50 to 80% of melting temperature. The resulting material is expected to have high thermal conductivities (600 W/mK) in X and Z directions.