Test Data Collection Using Automated Wafer Probers

罗彻斯特理工学院微电子工程系的测试数据收集设施允许他们的半导体工艺工程专业的学生评估其设计和工艺的质量，管理成品率改进，并从统计角度全面分析器件和工艺。这些学生在本科期间制造了数千个器件和电路，现在拥有半自动晶片级探测能力，可以在以前用于手动测试程序的相同测试时间内收集、分析和关联数量级以上的测试数据。用于测试转换的繁琐的重新连接到各种测试仪器正被灵活的矩阵交换系统所取代。只有在获得适当的衡量标准的情况下，才能确定设计和制造过程的质量。本实验室和整个微电子课程都会考虑密度结构、器件和电路中缺陷的自动测试结果。

A test data collection facility at the Microelectronic Engineering Department of the Rochester Institute of Technology allows their semiconductor process engineering students to evaluate the quality of their designs and processing, manage yield improvements, and thoroughly analyze devices and processes from a statistical point of view. The students, who fabricate thousands of devices and circuits in their undergraduate years, have now a semi-automatic wafer level probing capability to collect, analyze, and correlate orders of magnitude more test data in the same amount of test time previously devoted to manual test procedures. Tedious re- connections to various test instruments for test changeovers are being replaced by a flexible matrix switching system. The quality of the design and fabrication processes can be determined only if appropriate metrics are obtained. The results of automatic testing for defects in density structures, devices, and circuits are considered in this laboratory and throughout the microelectronics curriculum.