NSF Young Investigator Award

这是1992财年的NYI奖。研究将集中在两个方面：(1)电迁移和热应力引起的金属化扩散空化；(2)铁电陶瓷的力学。第一个问题涉及超大规模集成电路（VLSI）中金属互连中的扩散空化。将开发一种统一的热空化和电迁移方法，该方法将建立对设计变量（如材料特性、电流密度、热历史和互连配置）现象的明确依赖。这将使这样创建的数学模型能够通过与各种实验结果的比较来验证。第二个问题领域涉及铁电陶瓷的变形、极化和降解。该研究将为铁电陶瓷的畴壁运动和孪晶机制与应力、电场、变形和极化之间的宏观响应提供一个分析框架。这种基于物理的本构关系将用于研究交变电场作用下疲劳开裂的重要现象。

This is an NYI award for FY 92. The research will focus on two areas: (1) diffusive voiding in metallizations caused by electromigration and thermal stress, and (2) mechanics of ferroelectric ceramics. The first problem area involves diffusive voiding in metal interconnects in very large-scale integrated (VLSI) circuits. A unified approach to thermal voiding and electromigration will be developed that will establish the explicit dependence of the phenomena on design variables such as material properties, current density, thermal history and interconnect configuration. This will enable the mathematical model so created to be validated by comparison to a variety of experimental results. The second problem area is concerned with deformation, polarization and degradation of ferroelectric ceramics. The research will provide an analytical framework relating the mechanisms of domain wall motion and twinning to macroscopic response between stress, electric field, deformation and polarization of ferroelectric ceramics. This physically-based constitutive relation would be used to study the important phenomena of fatigue cracking under alternating electric fields.