Computer-Aided Engineering (CAE) for the Microelectronic Encapsulation Process

今天，从计算机、消费电子产品到军事装备，一切都是由微芯片驱动的，微芯片是微电子工业技术链中的第一环。为了扩展器件和系统设计的灵活性和能力，微电子封装正变得与硅制造一样重要。在现有的封装方法中，占市场份额80%的塑料封装将继续在微电子工业的增长中发挥主要作用。塑料包装的性能可靠性，很大程度上取决于封装剂的性能和制造方法。传统上，微电子塑料封装的设计和制造是基于经验和直觉进行的，成本高，耗时长。该研究旨在为表征该过程建立科学依据并获得工程解决方案。它将采用实验、分析和计算方面的努力来开发一种有效、可靠的分析工具。研究结果将提高对过程的理解，并促进计算机模拟的同步工程。

Today, everything from computers, consumer electronics, to military equipment is driven by micro-chips, the first link in the chain of technology for the microelectronic industry. In order to extend the flexibility and capacity of device and system design, microelectronic packaging is becoming as important as silicon fabrication. Among existing encapsulation methods, plastic packaging, which accounts for eighty percent of the market share, will continue to play a major role in the growth of the microelectronic industry. The performance reliability of plastic packaging, greatly depends on the performance of the encapsulants and manufacturing methods. Traditionally, design and manufacturing for microelectronic encapsulation with plastic packaging are conducted in an ad hoc manner based on experience and intuition, which is costly and time consuming. The study is aimed at establishing the scientific basis and attaining an engineering solution for characterizing the process. It will employ experimental, analytical and computational efforts to develop an efficient, reliable analysis tool. The results of the research will improve understanding of the process and facilitate simultaneous engineering by means of computer simulation.