Integrating Process Fundamentals, Facility Design and Production Control in Semiconductor Manufacturing Systems

9302099 乌兹索伊 半导体工业对国家经济福祉的重要性得到了广泛的认可，这使得许多不同的学科都在研究这一领域的问题。 过程分析、设计和表征在电气、化学和材料工程文献中已经得到了解决。然而，这一机构的研究集中在证明的可行性，生产功能的设备在研究环境中，在生产规划和控制问题，在制造设施中遇到的方式隔离。 虽然越来越多的研究人员研究了该行业的生产计划和控制问题，但这些工作尚未用于提供更有效的单元过程设计的见解，并且已经接受了现有的单元过程和设施设计。 人们越来越需要跨学科的努力来开发一个综合框架，在此框架内解决设计和控制半导体制造设施的问题，同时对材料加工和表征有基本的了解。 研究人员的经验和与半导体行业合作伙伴的互动表明，单元工艺选择和设计之间存在相当大的相互作用，工艺环境和微电子材料特性之间的相互关系，以及生产控制和设施布局方法。 这项研究是针对开发一个基本的，定量的了解这些相互作用的薄膜沉积和蚀刻工艺。 基础研究，以了解底层材料处理操作之间的复杂动态，它们之间的相互作用，以及它们的环境，这将使集成，创新的方法被开发用于半导体制造设施的设计和控制。 这些知识将被用来开发新的，有效的，调度方法，这些类型的工作中心，并研究如何不同的工作中心可以结合到制造系统，是成本效益和易于控制。 这项研究将需要一个强大的连续协同作用之间的详细单元过程模型和技术的生产系统的设计，控制和性能评估。

9302099 Uzsoy The widely acknowledged importance of the semiconductor industry to the economic well being of the country has led many different disciplines to study problems in this area. Process analysis, design and characterization have been addressed in the electrical, chemical and materials engineering literature. However, this body of research has concentrated on demonstrating the feasibility of producing functional devices in a research environment, in a manner isolated from the production planning and control problems encountered in manufacturing facilities. While production planning and control problems in this industry have been studied by a growing body of researchers, such work has not been used to provide insights into the design of more effective unit processes and has accepted existing unit process and facility designs as given. There is an emerging need for an interdisciplinary effort to develop an integrated framework within which to address the problem of designing and controlling semiconductor manufacturing facilities coupled with a fundamental understanding of materials processing and characterization. The researchers experiences and interactions with industrial partners in the semiconductor industry indicate there is considerable interaction among unit process selection and design, interrelationships between process environments and microelectronic material properties, and production control and facility layout methods. This research is directed towards developing a basic, quantitative understanding of these interactions for thin film deposition and etching processes. Fundamental studies to develop an understanding of the complex dynamics among underlying material processing operations, their interactions with each other, and their environments that will enable integrated, innovative methodologies to be developed for design and control of semiconductor manufacturing facilities. Such knowledge will be used to develop novel, effective, scheduling methodologies for these types of workcenters and to examine how different workcenters may be combined into manufacturing systems that are cost effective and easy to control. The research will require a strong continuous synergy between detailed unit process models and techniques for production system design, control and performance evaluation.