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Adsorbate Mediated Electrochemical Deposition of Metal Thin Films

Adsorbate Mediated Electrochemical Deposition of Metal Thin Films
吸附质介导的金属薄膜电化学沉积
批准号:
9322657
负责人:
Richard Alkire
金额:
$33.0万
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
1994
资助国家:
美国
项目状态:
已结题
起止时间:
1994-08-15 至 1998-07-31

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中文摘要
翻译
提案审查和分析提案编号:CTS-9322657 P.I.:R.C.Alkire等人机构:大学伊利诺伊州厄巴纳-香槟背景:(在此背景下,提案被审查)在先进材料和加工计划(AMPP)中,界面运输和分离工艺(ITSP)计划收到并审查了16份提案。所有16份提案都已发送供邮寄审阅。该提案的评审者来自以下项目或部门:ITSP化学反应过程、化学部和固态化学与聚合物。1994年5月4日,一个由五名专家组成的小组在国家科学基金会开会,对这16项建议进行了审查。小组成员收到了邮件评论,让他们与自己的个人评论一起考虑。他们被要求对提案进行排序,并将其归入以下三组之一:强烈推荐(如果资金可用)不推荐(不排名)分析:该提案被置于高度推荐类别(前三个提案)。根据评审员和专家小组成员的意见,强烈建议在较低的水平上提供赠款。以下项目已同意共同资助这项提议:ITSP、化学反应过程和固态化学与聚合物。Cts-9322657 Alkire et al,University of Illinois,Urbana-Champaign FY 94 FY 36,667 36,667 36,666 110,000 1401 36,667 36,666 110,000 1762 36,666 36,667 36,667 110,000总计110,000 110,000 110,000总计110,000 110,000
英文摘要
PROPOSAL REVIEW AND ANALYSIS Proposal Number: CTS-9322657 P.I.: R.C. Alkire et al Institution: Univ. of Illinois, Urbana-Champaign Context: (within which proposal was reviewed) Sixteen proposals were received and reviewed in the Advanced Materials and Processing Program (AMPP) by the Interfacial Transport and Separation Processes (ITSP) Program. All 16 proposals were sent out for mail review. This proposal had reviewers suggested by the following programs or division; ITSP Chemical Reaction Processes, Chemistry Division and Solid-State Chemistry and Polymers. The 16 proposals were then reviewed by a panel of five experts who met at NSF on May 4, 1994. the panelists were given the mail reviews to consider together with their own individual reviews. They were asked to rank-order the proposals and place them in one of three groups: Highly Recommended Recommended (if funds are available) Not Recommended (not rank-ordered) Analysis: This proposal was placed in the Highly Recommended category (top three proposals). A grant is highly recommended at a reduced level based upon comments from the reviewers and panelists. The following programs have agreed to co-fund this proposal: ITSP, Chemical Reaction Process, and Solid-State Chemistry and Polymers. CTS-9322657 Alkire et al, University of Illinois, Urbana-Champaign Schedule of Funding FY 94 FY 95 FY 96 TOTAL 1414 36,667 36,667 36,666 110,000 1401 36,667 36,666 36,667 110,000 1762 36,666 36,667 36,667 110,000 TOTAL 110,000 110,000 110,000 330,000
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Additive Mediated Nucleation and Growth during Electrodeposition: High-throughput Experiments and Multiscale Simulation
Adsorbate Mediated Electrodeposition: Experimental and Multiscale Numerical Investigations on Surface Roughness and Shape Evolution
Transport Studies on Pitting Corrosion (Materials Research)
Engineering Studies on Electrolytic Cells and Processes: Porous Electrodes, Shape Change, and Optimization
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