Nanocomposites for Thermal Management

由于各种电子部件的小型化，对更快、更小和更有效的电子设备的需求已经显著增长。因此，计算机芯片和其他微电子部件目前正经历每单位面积封装的器件数量的爆炸性增长。随着这些微电子器件的封装密度（器件数量）从超大规模集成电路（VLSI）发展到超大规模集成电路（ULSI），由这些器件耗散的热量也显著增加。这就需要研究和开发用于热管理应用的低热膨胀/高热导率复合材料。在第一阶段的工作中，材料修改公司。将开发纳米晶钨基（W-Cu）复合材料，使用两个阶段的过程，然后快速固结。第一阶段将集中在优化合成，巩固和特性的表征。第二阶段将集中于优化工艺-结构-性能参数，并与两家主要制造商合作，在实验室和现场设备中生产和测试原型（基板）。已经开始与这些制造商进行协调。

The need for faster, smaller, and more efficient electronic devices has grown considerably owing to the miniaturization of a variety of electronic components. Hence, computer chips and other microelectronic components are currently undergoing an explosive growth in the number of devices packed per unit area. As the packaging density (number of devices) of these microelectronic devices advances from very large scale integration (VLSI) to ultra-large scale integration (ULSI), the heat dissipated by these devices has also increased substantially. This has necessitated the research and development of low thermal expansion/high thermal conductivity composites for thermal management applications. In this Phase I effort, Materials Modification, Inc. will develop nanocrystalline tungsten-based (W-Cu) composites using a dual stage process followed by rapid consolidation. Phase I will focus on optimization of synthesis, consolidation, and characterization of the properties. Phase II will concentrate on optimization of process-structure-property parameters and the production and testing of prototypes (substrates) in both laboratory and field equipment in conjunction with two major manufacturers. Coordination has already been initiated with each of these manufacturers for this effort.