Nano-toughening of Conductive Composites with High Electrical Ductility

该项目旨在开发一种新技术，以有效增韧包括金属和导电聚合物在内的导电薄膜，并显著提高下一代可伸缩电子产品的机械稳定性。这项新技术将解决低屈服应变和低塑性导电薄膜由于塑性变形和长沟道裂纹而导致的可伸缩电子倾向突然电气故障的主要限制。通过克服现有导电薄膜材料延伸性和延展性低的瓶颈问题，将有可能显著扩大柔性和可拉伸电子器件的设计空间。

This project aims to develop a new technology to effectively toughen conductive thin films including metals and conductive polymers with significantly improved mechanical robustness for next-generation stretchable electronics. This new technique will tackle the major limitation of stretchable electronics propensity to abrupt electrical failure caused by plastic deformation and long channel cracks in conductive thin films of low yield strain and ductility. By overcoming the bottleneck issue of low stretchability and ductility of existing conductive thin film materials, it will be possible to significantly expand the design space of flexible and stretchable electronic devices.