Systematic investigations of low temperature Sn-Bi based solder alloys

该项目旨在通过开发用于低温组装工艺的Sn-Bi合金来降低电子电路制造中的温度，同时不影响生产率或可靠性。该项目将使用一系列创新的凝固和微观结构发展技术来了解这些合金在制造和应用过程中发生的沉淀、溶解和微观结构演变的动态过程。结果包括减少电子组装过程中的能耗，以及在不影响可靠性的情况下制造基于下一代温度敏感元件和基板的先进电路的能力。

The project aims to reduce the temperatures used in the manufacture of electronic circuitry through the development of Sn-Bi alloys for low temperature assembly processes without compromising productivity or reliability. The project will use a range of innovative solidification and microstructure development techniques to obtain an understanding of the dynamic processes of precipitation, dissolution and microstructure evolution that occur in these alloys during manufacture and application. The outcomes include a reduction in the energy consumed in electronic assembly processes and a capacity to manufacture advanced circuitry based on next-generation temperature-sensitive components and substrates without compromising reliability.