GOALI/IUCP: A Flow Simulation and Mold Design for Plastic Encapsulation of Microchips

9622246 Gupta在半导体制造中，适当的封装对于高组装产量和芯片的长期可靠性至关重要。然而，如果模具几何形状、封装材料和加工条件选择不当，塑料在转移成型过程中的流动可能会导致微芯片/引线框架组件的间隙运动以及连接线的变形。目前，模具设计是基于试错法。该合作奖将开发一种用于封装过程的流动模拟的软件工具，以便模具设计者能够预测模压设备中的缺陷，并相应地修改模塑过程，以减少生产过程中的组装缺陷。这项工作可能会在流体流动/固化组合模型的开发方面提供重大进展，该模型可扩展到封装工艺之外的其他应用。

9622246 Gupta A proper encapsulation is essential for high-assembly yields and a long-term reliability of the chip in the semiconductor manufacturing. However, if the mold-geometry, encapsulating material and the processing conditions are not selected properly, the flow during the transfer molding of plastic may produce a gapwise movement of the microchip/leadframe assembly as well as deform the connecting wires. Currently, the mold design is based upon trial-and-error approach. This collaborative GOALI award will develop a software tool for flow simulation of the encapsulation process so that the mold designer will be able to predict the defects in the molded device and modify the molding process accordingly to reduce the assembly defects during production. This work is likely to provide significant advancement in the development of a combined fluid-flow/curing model which is expandable to other applications outside of the encapsulation processes.