SBIR Phase I: An Ultra-Fast Signal Integrity Analyzer for Multi-Layer Electronic Packages and Boards

这个小企业创新研究第一阶段项目将确定科学、技术和商业价值，以及开发用于多层集成电路芯片封装和印刷电路板的超快速信号完整性分析仪的可行性。集成电路转换速度和封装密度的不断提高对电子封装设计提出了严峻的挑战。准确的信号完整性分析需要电磁场仿真和电路仿真一起进行。现有的通用商用电磁工具无法为实际的电子封装提供及时且经济有效的解决方案。该项目将研究一种新的方法，该方法将比传统的通用工具在电子封装中执行电磁模拟的速度快几个数量级。该方法将多层电子封装中的三维电磁场分解为几个最重要的模式，并采用特殊的快速算法求解每个模式的电磁场。所提出的信号完整性分析仪将快速电磁场求解器与传输线和电路求解器集成在一起，从而自动考虑封装和IC芯片之间的相互作用。该项目将研究该技术的适用性以及所提出的信号完整性分析仪在实际封装结构中的可行性。预计本提案中描述的技术可以显着减少电磁场模拟时间，并导致商业信号完整性工具，可以为电子封装和印刷电路板的评估和设计提供及时和经济有效的手段。这种信号完整性工具对于新兴的高速电子系统至关重要，一旦商业化，将产生重大而直接的影响。* * *

*** 96-60681 Chen This Small Business Innovation Research Phase I project will determine scientific, technical, and commercial merit and feasibility of developing an ultra-fast signal integrity analyzer for multi-layer integrated-circuit chip packages and printed circuit boards. Ever increasing integrated-circuit transition speed and packaging density have posed severe challenge to electronic packaging designs. Accurate signal integrity analysis necessitates electromagnetic field simulations to be performed together with circuit simulations. Existing general-purpose commercial electromagnetic tools are unable to provide timely and cost effective solutions for practical electronic packages. This project will investigate a novel method that would be orders of - magnitude faster than conventional general-purpose tools in performing electromagnetic simulation in electronic packages. With the new technique, three-dimensional electromagnetic fields in multi-layer electronic packages are decomposed into several most significant modes, and each mode of field is solved with special fast algorithms. The proposed signal integrity analyzer integrates the fast electromagnetic field solver with transmission line and circuit solvers so that interactions between packages and IC chips are automatically taken into account. Applicability of the technique and feasibility of the proposed signal integrity analyzer for real-world packaging structures are to be investigated in this project. It is anticipated that the technique described in this proposal can dramatically reduce the electromagnetic field simulation time and lead to commercial signal integrity tools that can provide timely and cost effective means for the evaluation and design of electronic packages and printed circuit boards. Such signal integrity tools are crucial for emerging high-speed electronic systems, and should have significant and immediate impacts once they are commercially available. ***