SBIR Phase II: Ultra-high Throughput Parallel Optical Links for Chip-to-Chip Interconnects
SBIR 第二阶段:用于芯片间互连的超高吞吐量并行光链路
基本信息
- 批准号:2151747
- 负责人:
- 金额:$ 98.92万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Cooperative Agreement
- 财政年份:2022
- 资助国家:美国
- 起止时间:2022-09-01 至 2024-08-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase II project is to create very low power and very high capacity optical interconnects for general computer applications. Computer performance is limited by the speed, power, and latency of connections between chips and memory. The limitations of electrical interconnects are well known, and optical interconnects overcome the limitations and offer 100-1000 times performance improvements. While historically optical interconnects have been hampered by high cost and high power, recent developments show that the promise of optical interconnects can be practically realized. Optical interconnects will dramatically improve overall performance of enterprise and cloud computing services, especially when used in data center computers, while reducing electrical power consumption. This will in turn permit a vast improvement in resource utilization and dramatic reduction in the cost of computation across all segments of societyThe proposed project will develop an optical peripheral component interconnect expreess (PCIe)-compatible transparent bridge for general computer interconnects. PCIe is the most prevalent interconnect used today in computers. The technology developed in this proposal, based on light emitting diode (LED)-based transmitters, multicore optical fibers, and complementary metal-oxide semiconductor (CMOS)-compatible photodetectors, seeks to reduce electrical power consumption from ~10 pJ/bit for electrical solutions to ~100-200 fJ/bit. The use of LEDs leverages investments already made for cost and power effective LED lighting and displays. The small size of the LEDs and multicore fibers allows for data densities of 1 Pbps/cm2. Electrical interconnects and other optical interconnect technologies cannot compare with the performance of these LED based optical interconnects. These advantages enable physical disaggregation of the compute, storage, and memory functions, improving system performance and resource utilization. This Phase II effort is focused on the development of a PCIe-compliant transparent bridge for applications in chip to chip and chip to memory interconnects.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
这个小型企业创新研究(SBIR)第二阶段项目的更广泛的影响/商业潜力是为通用计算机应用创建非常低功率和非常高容量的光学互连。计算机性能受到芯片和内存之间连接的速度、功率和延迟的限制。电互连的局限性是众所周知的,而光互连克服了这些局限性,并提供了100-1000倍的性能改进。虽然历史上光互连一直受到高成本和高功率的阻碍,但最近的发展表明,光互连的前景可以实际实现。光互连将显著提高企业和云计算服务的整体性能,特别是在数据中心计算机中使用时,同时降低电力消耗。这反过来又将允许在资源利用率和计算成本在社会的所有部分的大幅降低的巨大改善建议的项目将开发一个光学外围组件互连expreess(PCIe)兼容的透明桥一般计算机互连。PCIe是当今计算机中使用的最普遍的互连。该提案中开发的技术基于基于发光二极管(LED)发射器、多芯光纤和互补金属氧化物半导体(CMOS)兼容光电探测器,旨在将电力消耗从电气解决方案的约10 pJ/bit降低到约100-200 fJ/bit。LED的使用利用了已经为成本和功率有效的LED照明和显示器所做的投资。LED和多芯光纤的小尺寸允许1 Pbps/cm 2的数据密度。电互连和其它光学互连技术不能与这些基于LED的光学互连的性能相比。这些优势支持计算、存储和内存功能的物理分解,从而提高系统性能和资源利用率。第二阶段的工作重点是为芯片到芯片和芯片到存储器互连的应用开发符合PCIe标准的透明桥。该奖项反映了NSF的法定使命,并通过使用基金会的知识价值和更广泛的影响审查标准进行评估,被认为值得支持。
项目成果
期刊论文数量(0)
专著数量(0)
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会议论文数量(0)
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Bardia Pezeshki其他文献
High Temperature and Large Bandwidth Blue InGaN/GaN Micro-LEDs
高温、大带宽蓝色 InGaN/GaN Micro-LED
- DOI:
- 发表时间:
2024 - 期刊:
- 影响因子:0
- 作者:
Daniel Rogers;Haotian Xue;Fred A. Kish;Bardia Pezeshki;A. Tselikov;Jonathan J. Wierer - 通讯作者:
Jonathan J. Wierer
304 channel MicroLED based CMOS transceiver IC with aggregate 1 Tbps and sub-pJ per bit capability
基于 304 通道 MicroLED 的 CMOS 收发器 IC,具有聚合 1 Tbps 和每比特低于 pJ 的能力
- DOI:
10.1364/ofc.2024.m3a.1 - 发表时间:
2024 - 期刊:
- 影响因子:0
- 作者:
Bardia Pezeshki;Suresh Rangarajan;A. Tselikov;E. Afifi;Ivan Huang;Jeff Pepper;Sarah Zou;Howard Rourke;Rowan Pocock;Alasdair Fikouras;Farzad Khoeini;Vahid Mirkhani;Steve Novak;Robert F. Kalman - 通讯作者:
Robert F. Kalman
Parallel Versus Serial: Design of an Optical Receiver With Integrated Blue Photodetectors and Digitally Tunable Low-End Cutoff Frequency for MicroLED-Based Parallel Interchip Communication
并行与串行:具有集成蓝色光电探测器和数字可调低端截止频率的光接收器设计,用于基于 MicroLED 的并行芯片间通信
- DOI:
10.1109/jssc.2023.3322044 - 发表时间:
2024 - 期刊:
- 影响因子:5.4
- 作者:
F. Khoeini;Bardia Pezeshki;E. Afifi;A. Tselikov;Robert F. Kalman;Bahareh Hadidian;Ehsan Afshari - 通讯作者:
Ehsan Afshari
Efficient compact tunable laser for access networks using silicon ring resonators
使用硅环谐振器用于接入网络的高效紧凑型可调谐激光器
- DOI:
10.1364/ofc.2012.ow1g.4 - 发表时间:
2012 - 期刊:
- 影响因子:0
- 作者:
G. Yoffe;Trinh M. Nguyen;John Heanue;Bardia Pezeshki - 通讯作者:
Bardia Pezeshki
Bardia Pezeshki的其他文献
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{{ truncateString('Bardia Pezeshki', 18)}}的其他基金
SBIR Phase I: Ultra-high throughput parallel optical links for chip-to-chip interconnects.
SBIR 第一阶段:用于芯片间互连的超高吞吐量并行光链路。
- 批准号:
2036649 - 财政年份:2021
- 资助金额:
$ 98.92万 - 项目类别:
Standard Grant
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