Modeling and Experimentation of Power Magnetic Components at Temperature Units

温度限制下功率磁性元件的建模和实验随着工作温度高达300 ℃的半导体器件的出现，越来越需要制定高温、高功率密度应用中功率转换器的设计范例。 由于功率磁元件（POMADES）是功率转换器的组成部分，其设计的温度尽可能高，或“温度极限”，是上述范式的一个重要组成部分。因此，提出了一个跨学科的研究计划，将采取新的眼光在核心材料和组件建模，仿真，配置，实验测量和设计优化。 建议的工作是“令人耳目一新”的，因为温度将是第一位的重要性，不会被忽视。 结果预计将是有用的，不仅是高温，但也低温magneticdesigns.The核心材料将被建模的温度依赖性的“测量核心模型”，其特征的内在磁性能和几何/尺寸的影响。 温度将通过温度感应的、场相关的函数来强调，这些函数修改所施加的磁场，从而随着温度的变化而重塑静态磁滞回线。滞后现象的频率和几何形状依赖性将通过滤波器或由麦克斯韦方程的有限元离散化和模型简化技术得到的等效电路来建模。 “矩阵”配置，平面配置，“混合芯，”和“散热器”在均匀分布的电磁和热变量的有效性将被调查，作为手段，以扩大temperaturelimits.POMAC模型将开发POMAC与其他转换器组件的有效耦合非线性电磁热模拟。 该模型可以预测通量和温度的不均匀性，由于频率，几何形状，和自热效应，再加上材料参数的退化温度极限附近，最终导致热失控。 POMAC模型将包括耦合的电和热子电路，其表示通量和温度的弱非均匀分布的电和热子结构。 子电路拓扑结构将是高阶（在几何和频率意义上）的测量核心模型的推广。 通过子结构和模型简化技术，从电气和热有限元矩阵中提取子电路组件。将获得并公布堆芯材料和POMAC在温度极限和多兆赫频率范围内的实验测量数据。 温度敏感设计优化将从推导性能参数集（例如温度极限、功率密度、效率和带宽）与输入参数集（例如， 温度、尺寸和激励波形）。 设计指南，性能界限，以及设计权衡独特的操作温度极限附近将被建立。

Modeling and Experimentation of Power Magnetic Components at Temperature LimitsWith the availability of semiconductor devices that operate at temperatures up to 300'C, there is a growing need in the formulation of a design paradigm for power converters in high-temperature, high-power-density applications. Since Power Magnetic Components (POMADES) are an integral part of power converters, their engineering for temperatures that are as high as possible, or "temperature limits," is an essential part of the said paradigm.Thus, an interdisciplinary research program is proposed that will take a refreshing look at core material and component modeling, simulation, configurations, experimental measurements, and design optimization. The proposed work is "refreshing" in that temperature will be of first-order importance, and will not be conveniently neglected. The results are expected to be useful for not only high-, but also low-temperature magnetic designs.The core materials will be modeled by temperature-dependent "measured-core models" that characterize both the intrinsic magnetic properties and the geometry/dimensional effects. Temperature will be emphasized by temperature-induced, field-dependent functions that modify the applied magnetic fields, thereby reshaping the static hysteresis loops as temperature changes. The frequency and geometry dependencies of the hysteresis phenomenon will be modeled by filters, or by the equivalent circuits that result from finite-element discretization of Maxwell's equations and from model-reduction techniques.POMAC configurations will be identified that are suitable for high-temperature operation. The effectiveness of "matrix" configurations, planar configurations, "hybrid cores," and "heat spreaders" in distributing the electromagnetic and thermal variables uniformly will be investigated as means to extend the temperature limits.POMAC models will be developed for efficient coupled nonlinear electro-magneto-thermal simulation of POMACs with the other converter components. The models can predict flux and temperature nonuniformities due to frequency-, geometry-, and self-heating effects that, when coupled with the degradation of material parameters near temperature limits, ultimately lead to thermal runaway. A POMAC model will comprise coupled electrical and thermal subcircuits representing electrical and thermal substructures of weakly nonuniform distribution of flux and temperature. The subcircuit topology will be the high-order (in the geometry and frequency sense) generalization of the measured-core model. The subcircuit components are extracted from the electrical and thermal finite-element matrices by substructuring and model-reduction techniques.Experimentally-measured data for the core materials and POMACs at temperature limits and in the multimegahertz frequency range will be obtained and published. These data are not widely available and difficult to find in the literature.The temperature-sensitive design optimization will start with the derivation of analytical relationships between the set of performance parameters (e.g. temperature limits, power density, efficiency, and bandwidth) and the set of input parameters (e.g., temperature, dimensions, and excitation waveshapes) using the multiple response surface methodology. Design guidelines, performance boundaries, and design trade-offs unique to operation near temperature limits will be established.