SBIR Phase I: Data Driven Microjet Printing of Electrostatically Self-Assembled Multilayer Electronic Materials and Devices

9960078 Cooper，Kristie Nanosonic Inc.这项SBIR第一阶段计划将展示通过数据驱动的微喷雾打印多功能静电自组装薄膜的原型和制造多层电子元件的可行性。从弗吉尼亚理工学院获得许可的静电自组装(ESA)过程涉及在室温和压力下连续形成交替的、相反电荷的金属和金属氧化物纳米团簇、聚合物和其他分子的单分子层。多层膜的电、光、磁和机械性能由每个单分子层中分子的性质和单分子层的长程有序性决定。在这个原型系统中，操作员输入计算机代码和化学品，并检索完整的测试文章进行分析。在第一阶段计划中，这项工作将扩展到论证通过微喷喷涂形成类似的多层、多功能部件的可行性，并将分析所制造的微部件的分子水平和宏观性能。数据驱动的微喷雾ESA处理将允许快速设计、合成和分析用于通信、显示、仪器和其他电子应用的原型电子设备。具有多微米分辨率的MicroJet ESA形成的电子设备将允许以低成本、快速可重新配置的方式制造电子互连、电路元件、简单显示器和传感器。

9960078Cooper, KristieNanosonic IncorporatedThis SBIR Phase I program will demonstrate the feasibility of prototyping and fabricating multilayer electronic components by the data driven microjet spray printing of multifunctional electrostatically self-assembled thin films. The electrostatic self-assembly (ESA) process, licensed from the Virginia Polytechnic Institute, involves the consecutive formation of alternating, oppositely charged monolayers of metal and metal oxide nanoclusters, polymers and other molecules, at room temperature and pressure. The electronic, optical, magnetic and mechanical properties of the multilayer films are determined by the nature of the molecules in each monolayer and the long-range order of the monolayers. In this prototyping system, the operator inputs computer code and chemicals, and retrieves completed test articles for analysis. During the Phase I program this work will be extended to demonstrate the feasibility of forming similar multilayer, multifunctional components by microjet spraying, and would analyze the molecular-level and macroscopic properties of the fabricated microcomponents. Data driven microjet spray ESA processing would allow the rapid design, synthesis and analysis of prototype electronic devices for communication, display, instrumentation and other electronics applications. Microjet ESA-formed electronic devices with many-micron resolution would allow the low-cost, rapidly reconfigurable fabrication of electronic interconnects, circuit components, simple displays and sensors.