SBIR Phase I: Photolithographic Patterning of Reactive Nano-scale Multilayer Materials for Hermetic Wafer Scale Packaging

这个小型企业创新研究第一阶段项目涉及对用于MEMS和其他电子设备的密封晶片级封装的活性纳米级多层箔进行光刻图案化的可行性研究。夹在两个晶片之间的图案化反应箔可以点燃并自我传播，提供晶片键合所需的热量。由于反应非常迅速，热量集中在铝箔附近。因此，可以获得限制于光刻图案的高温密封键，而密封封装内的温度敏感元件保持不受影响。这些薄片还可以用来连接热膨胀系数大不相同的不同材料，而不会产生很大的残余应力。今天生产的一个典型的MEMS器件，80%的制造成本花在了封装上。晶片规模封装将极大地降低这一成本，因为它利用了半导体行业的知识、设备和成本模型。其特点包括密封性、小型化、大规模并行组装、具有更高重复性和成品率的自动化设备，以及电子、光学和机械功能的实质性集成。如本提案所述，反应性箔的图案化将实现晶片键合，这种键合一般可用于传感、光学、医疗、射频和其他MEMS设备的低成本微型化封装。

This Small Business Innovation Research Phase I project involves a feasibility study of lithographically patterning reactive nanoscale multilayer foils for use in hermetic waferscale packages for MEMS and other electronic devices. A patterned reactive foil sandwiched between two wafers can be ignited and will self-propagate, providing the heat needed for wafer bonding. Because the reaction is very rapid, heat is localized to the vicinity of the foil. Therefore high temperature hermetic bonds confined to the lithographic pattern are obtainable, while temperature sensitive components inside of the sealed package remain unaffected. These foils can also be used to join dissimilar materials with dramatically different thermal expansion coefficients without creating large residual stresses. A typical MEMS device produced today, 80% of the manufacturing cost goes into packaging. Waferscale packaging will dramatically reduce this cost because it leverages knowledge, equipment, and cost models from the semiconductor industry. Features include hermeticity, miniaturization, massively parallel assembly, automated equipment with increased repeatability and yields, and substantial integration of electronic, optical, and mechanical features. Patterning of reactive foils as covered in this proposal will enable wafer bonding that can be generically used for low cost miniaturized packaging of sensing, optical, medical, RF and other MEMS devices.