SBIR Phase I: Ultra High Thermal Conductivity Substrate for High Power Optoelectronics

这个小型企业创新研究(SBIR)第一阶段项目将开发一种用于光电子封装的高导热、低热膨胀系数和低重量的基板材料。金属基复合材料(MMC)系统采用高导热金属合金作为连续金属基体，超高导热颗粒作为离散增强相。使用此工艺生产的散热器在烧制时几乎是净形状，需要最少的加工才能满足规格。材料的热膨胀系数(CTE)可以与放置在顶部的模具的热膨胀系数相匹配。通过调整复合材料的组成，获得了与硅和砷化镓的良好匹配。该复合材料的性能优于市场上现有的其他MMC基板体系。它比铜/钨或铜/钼轻；比铜/钨或铝/碳化硅具有更好的导热性；与芯片的热膨胀匹配比任何一种都要好。这种超高导热金属基复合材料的独特之处在于，可以更好地设计载体基板，以匹配芯片或连接到载体基板的其他发热组件的热膨胀特性，同时还提供改进的热传递。在商业上，高导热系数散热器材料在用于水下和长距离相关应用的光纤组件中的需求量很大，包括放大器、接收器、发射器、可调激光器、调制器；也用于语音和高速数据传输以及医疗和研究激光。其他应用领域包括用于蜂窝电话、基站、高清晰度电视(HDTV)和卫星通信的无线电信基础设施中的射频功率组件。该材料还在航空航天、军用雷达和制导系统的先进汽车或点火系统中有重要应用。

This Small Business Innovation Research (SBIR) Phase I project will develop a high thermal conductivity, low coefficient of thermal expansion, and low weight substrate material for optoelectronics packaging. The metal matrix composite (MMC) system uses a high thermal conductivity metallic alloy as the continuous metal matrix and ultra high thermal conductivity particulates as the discrete reinforcement phase. Heat sinks produced using this process are near net shape as fired, requiring minimum machining to meet specifications. The coefficient of thermal expansion (CTE) of the material can be made to match that of the die that will be placed on top. A good match to silicon and to gallium arsenide is obtained by adjusting the composition for the composite. The composite has better properties than other existing MMC substrates systems in the market. It is lighter than Cu/W or Cu/Mo; has better thermal conductivity than Cu/W or Al/SiC; and exhibits a better thermal expansion match to the die than any of them. The uniqueness of this ultra high thermal conductivity metal matrix composite is that the carrier substrates can be better designed to match the thermal expansion characteristics of the chip or other heat-generating components attached to the carrier substrate while also providing improved heat transfer. Commercially, high thermal conductivity heat sink materials are in high demand in fiber optic components intended for underwater and long haul related applications including amplifiers, receivers, transmitters, tunable lasers, modulators; also for voice and high speed data transmissions and medical and research lasers. Other areas of application include RF power package components that are used in wireless telecommunication infrastructure for cellular phones, base stations, high definition television (HDTV), and satellite communications. The materials also have important applications in advanced automotive or ignition systems intended for aerospace applications, military radar, and guidance systems.