SBIR Phase I: Compact Heat Sink using Microscale Ion Driven Air Flow

这个小型企业创新研究第一阶段项目旨在展示设计和制造微型离子驱动空气流散热器装置的可行性。将消费电子产品的温度维持在可接受的水平所需的热去除率正以指数速率增加。尽管热通量有所增加，但由于成本低且简单，用空气冷却电子设备仍然是热管理的首选方法。然而，传统的散热装置无法在小型便携式电子设备（如笔记本电脑）中实现这些传热速率。该装置具有与传统风扇和散热器散发相同热量的潜力，但尺寸只有传统风扇和散热器的十分之一。为了证明这项技术的可行性，将进行一系列有针对性的模型和实验。该项目最终将进行系统级可行性研究，该研究将通过模型和实验证明该技术冷却电子设备的能力。该项目的商业应用是用于小型便携式电子设备（如笔记本电脑）的散热器。这项研究的目标是开发和生产一种紧凑的散热器，它将完全没有噪音，重量轻，比任何其他风冷散热设备更小，更便宜。该散热器将具有广泛的商业化潜力，特别是在笔记本电脑、未来的手机和其他移动计算应用中。它将允许在这些小型便携式封装中使用高性能cpu。这也将促进计算机芯片的进一步小型化和集成化。

This Small Business Innovation Research Phase I project proposes to demonstrate the feasibility of designing and fabricating a Microscale Ion Driven Air Flow heat sink device. The heat removal rate required to maintain the temperature of consumer electronics at an acceptable level is increasing at an exponential rate. In spite of the rise in heat fluxes, cooling electronics with air continues to be the preferred method of thermal management because of its low cost and simplicity. However, conventional heat-sinking devices are not able to achieve these heat transfer rates in small portable electronics such as laptop computers. The proposed device has the potential to dissipate the same amount of heat as a conventional fan and heat sink, but in 1/10th the size. To prove the viability of this technology, a series of targeted models and experiments will be run. The program will culminate with a system level feasibility study that will demonstrate, through models and experiments, the ability of this technology to cool electronic equipment.The commercial application of this project is a heat sink for use with small portable electronic devices such as laptop computers. The goal of this research is to develop and produce a compact heat sink that will be completely noiseless, lightweight, smaller and cheaper than any other air-cooled heat-sinking device. The heat sink will have broad commercialization potential, particularly in laptop computers, future cell phones, and other mobile computing applications. It will allow the use of high-performance CPUs in these small portable packages. This will also facilitate further miniaturization and integration of computer chips.