NUMIFORM 2004, 8th International Conference on Numerical Methods in Industrial Forming Processess; Columbus, Ohio; June 13-17, 2004

这笔赠款提供支持，使学生能够参加2004年NUMIFORM会议，该会议将于6月13日至17日在俄亥俄州州立大学举行。 该会议在美国、欧洲和日本，每三年举行一次，汇集了工业成型工艺领域的研究人员，讨论材料和制造工艺建模的最新进展和未来方向。 会议强调金属和聚合物的传统加工，并将包括不同规模的先进材料和新兴制造方法。 主题将包括块体和片材成型，超塑性成型，铸造，成型，淬火，材料连接和粉末成型，机械加工，热机械加工，化学加工，聚合物加工，表面处理，食品加工，复合材料制造和反应液体成型。这笔赠款将使大约20名学生参与，并将为他们提供增强的教育经验，让他们有机会见到他们所选领域的顶尖研究人员。 本次会议的主题领域对国家的经济健康至关重要，包括保持熟练劳动力的重要领域。

This grant provides support to enable students to participate in the 2004 NUMIFORM conference, which will be held at the Ohio State University, June 13-17. The conference, which rotates between the U.S., Europe and Japan, and which is held every three years, brings together researchers in the field of industrial forming processes to discuss recent advances and future directions in the modeling of materials and manufacturing processes. The conference emphasizes traditional processing of metals and polymers, and will include advanced materials and emerging manufacturing approaches at different scales. Topics will include bulk and sheet forming, superplastic forming, casting, molding, quenching, materials joining and powder forming, machining, thermal mechanical processing, chemical processing, polymer processing, surface treatment, food processing, composite manufacturing and reactive liquid molding.This grant will enable the participation of about 20 students, and will provide them with an enhanced educational experience, and give them a chance to meet the top researchers in their chosen field. The topical areas of this conference are vital to the economic health of the nation, and include areas where it is important to maintain a skilled workforce.