Transmission Laser Bonding for MEMS Packaging

这项研究的目的是发展一种称为透射式激光键合的晶片键合技术，使其可靠并适用于微电子机械器件的封装。该方法是利用实验和数值方法在微米和纳米尺度上研究键合过程中和键合后键合区域的物理和化学现象。利用激光的特性和相关的光学特性，该技术可以通过激光熔化界面附近的薄层来将透明晶片(如玻璃)有效地结合到不透明的衬底(如硅)上。随着所提出的研究的成功完成，在微器件封装方面潜在的成本节约和质量提高将是显著的。由于封装成本占设备总成本的50%以上，因此拟议的研究对相关行业应该非常重要。目前，这些微器件产品的应用已经从传统的汽车和航空航天领域扩展到包括消费电子、生物医学和信息在内的许多新兴市场，这些产品应该会直接或间接地对人们的日常生活产生重大影响。此外，从拟议的调查中获得的知识库可以极大地提高对所涉及的许多领域的基本了解，包括表面和材料科学、力学、传热学和流体流动，以及整个粘接技术。提出的方法应该教育学生具有扎实的基础知识，并在基础研究和应用之间取得良好的平衡，学习包装。

The objective of this research is to advance a wafer-bonding technique, called the transmission laser bonding, to be reliable and applicable for packaging of microelectromechanical devices. The approach is to use both experimental and numerical schemes to study the physical and chemical phenomena in the bonding region during and after bonding at micro- and nano-scale levels. Using characteristics of laser and the associated optical properties, the technique can efficiently bond a transparent wafer, such as glass, to an opaque substrate, such as silicon, by laser melting of a thin layer near the interface.With the successful accomplishment of the proposed research, the potential cost saving and quality enhancement on microdevice packaging will be significant. Since packaging cost represents more than fifty percent of the total device cost, the proposed research should be extremely important to the associated industry. Currently, the applications of these microdevice products have been extended from the traditional automotive and aerospace sectors to many emerging markets, including consumer electronics, biomedical, and information; the products should have major impact directly or indirectly on people's daily life. Furthermore, the knowledge base gained from the proposed investigation can greatly improve the fundamental understanding of many areas involved, including the surface and materials sciences, mechanics, heat transfer, and fluid flow, as well as the bonding technology as a whole. The proposed approach should educate students to have sound basic knowledge with good balance between fundamental research and application in studying packaging.