SBIR Phase I: Nanowire Structures for Thermal Management

这个第一阶段的SBIR项目旨在开发用于电子热管理设备的被动纳米线阵列的制造技术。该项目团队建议开发一种使用被动纳米线阵列结构的热管技术，该结构是制造低调、高性能热管/散布器设备的不可或缺的组成部分。无源纳米线阵列的使用是低轮廓热管设备的使能创新。纳米线阵列允许将热管的高度降低到不到1毫米(0.040英寸)，并用于传统的热管理设备不能满足的情况。开发制造大片纳米线阵列的工艺将使自动化设备能够以低成本生产大量此类设备，同时满足下一代电路的性能需求。将制定一项战略，制造大面积结构，然后用于大容量、低成本的热管制造的自动化组装设备。在商业上，随着1亿晶体管电路的功耗超过100W变得司空见惯，电子系统中的热管理问题已经变得至关重要。拟议技术的开发将使高功率电路和设备能够插入较小的系统外壳中，从而在不牺牲性能的情况下继续减小整体系统尺寸。热管器件自动化组装工艺的开发将使热管成本降低，进入主流电子市场。

This Phase I SBIR project aims to develop manufacturing techniques for passive nanowire arrays to be used in electronics thermal management devices. The project team proposes to develop a heat pipe technology using passive nanowire array structures that are an integral component in the manufacture of low profile, high performance heat pipe/spreader devices. The use of passive nanowire arrays is the enabling innovation for the low profile heat pipe devices. The nanowire arrays allow the height of the heat pipe to be reduced to less than 1 mm (0.040") and to be used where conventional thermal management devices are inadequate. Developing the processes for creating large sheets of nanowire arrays will enable automated equipment to produce large numbers of these devices at low cost while meeting the performance needs of next generation circuits. A strategy will be defined to manufacture large area structures that can then be used in automated assembly equipment for high volume, low cost heat pipe manufacture.Commercially, the thermal management issue has become critical in electronics systems as circuits with 100 million transistors dissipating more than 100 W become commonplace. Development of the proposed technology will enable high power circuits and devices to be inserted into smaller system enclosures, allowing for the continued decreases in overall system size without sacrificing performance. The development of anautomated assembly process for heat pipe devices will enable heat pipe cost to bereduced and enter the mainstream electronics market.