Fundamentals of Dielectric Charging for Functional Plastic Transistors, and Integeration of Charging and Printing Process for Circut Fabrications

本研究的目的是研究电荷注入有机/塑料场效应晶体管栅极介质的效应、机制和限制，并开发与卷对卷印刷完全集成的电荷注入工艺。晶体管中的带电介质提供了在运行过程中预置ofet的电导而不寻址栅极的机会，为晶体管提供了一个非易失性阈值电压偏移，在单个有机半导体中反转多数载流子，最重要的是，用相同的材料和相同的架构制造出具有不同特性的晶体管。在制造复杂的印刷/塑料电路时，大大减少了打印多个半导体的需要。该方法是合成具有优化充电稳定性和最大电荷诱导调制的官能团和能级的新半导体，利用具有改进成膜能力的电介质，通过印刷工艺和最疏水的表面功能，优化充电动力学，并将工艺转移到位于德国的快速滚装充电设备。其知识价值将包括为无线识别标签的印刷电路提供一种有价值的新方法，无线识别标签没有可印刷的、实用的和稳定的替代品，而且需求越来越大。用于国土安全的传感器阵列和可重构塑料电路是其他可能的技术应用。将探索新的化合物、固体和物理现象。更广泛的影响包括本科工程实验室的增强，初中和高中推广活动的演示，以及适合高中电子教学的模块。国际合作对研究生学员来说尤其具有启发性。

The objective of this research is to study effects, mechanisms, and limits of charge implantation into gate dielectrics of organic/plastic field-effect transistors and to develop processes for charge implantation that are fully integrated with roll-to-roll printing. Charged dielectrics in transistors offer the opportunity to preset the conductance of OFETs without addressing gate electrodes during operation, to impart a nonvolatile threshold voltage offset to transistors, to reverse the majority carrier in a single organic semiconductor, and most importantly, to fabricate transistors with different characteristics out of the same materials and with the same architectures, greatly diminishing the need to print multiple semiconductors when fabricating complex printed/plastic circuits. The approach is to synthesize new semiconductors with functional groups and energy levels optimized for charging stability and maximum charge-induced modulation, utilization of dielectrics with improved film-forming capabilities via printing processes and the most hydrophobic possible surface functionalities, optimizing charging dynamics, and process transfer to rapid roll-mounted charging apparatus located in Germany. The intellectual merit will include a valuable new approach for printing circuits of commercial interest for wireless identification tags, for which there are no printable, practical, and stable alternatives, and which are increasingly in demand. Sensor arrays for homeland security and reconfigurable plastic circuits are other likely technological applications. New compounds, solids, and physical phenomena will be explored. Broader impact includes undergraduate engineering laboratory enhancements, demonstrations for middle and high school outreach events, and modules suitable for high school electronics instruction. The international collaboration will be especially enlightening for graduate student trainees.