STTR Phase I: Laser Ablation - Diamond Turning Hybrid Process for Brittle Material Machining

这个小型企业技术转移（STTR）第一阶段项目是由Mound激光和光子学中心和西密歇根大学制造研究中心合作开展的，将通过结合激光加工金刚石加工来开发一种新的、协同的方法，用于脆性材料和半导体的精密加工。该方法有可能大大减少金刚石机床的磨损，提高成品陶瓷的表面质量，并降低加工和平滑这些众所周知难以加工但又急需的材料的总体工艺成本。开发一项成功的技术将立即影响用于航空航天应用的碳化硅反射镜和用于高温电子产品的单晶碳化硅晶圆领域。其他潜在用途包括制造结构航空部件、传感器、陶瓷轴承和密封件。高性能陶瓷在所有这些领域的开发目前受到成本效益和无损伤工程陶瓷制造技术的限制。该项目将为学生提供参与先进的、最先进的材料加工技术发展的宝贵机会。

This Small Business Technology Transfer (STTR) Phase I project, a collaboration between Mound Laser and Photonics Center and the Manufacturing Research Center at Western Michigan University, will develop a novel, synergistic method for precision machining of brittle materials and semiconductors by combining laser processing diamond turning. The method has the potential to greatly reduce wear of diamond machine tools, improve the surface quality of finished ceramics, and reduce overall process costs for machining and smoothing these notoriously difficult to process yet critically needed materials. Developing a successful technology will immediately impact the areas of silicon carbide mirrors for aerospace applications, and single crystal silicon carbide wafers for high temperature electronics. Other potential uses include fabrication of structural aerospace components, sensors, and ceramic bearings and seals. Exploitation of high performance ceramics in all of these areas is currently limited by the state of the art in cost effective, damage-free fabrication of engineered ceramics. The project will provide a valuable opportunity for students to participate in the advanced, state-of-the-art materials processing technology development.