Interconnect Networks for Three-Dimensional Gigascale System-on-a-Chip

NSF提案0701560 M。本研究的目的是开发一个三维集成的千兆级片上系统所需的互连网络。该方法是进行实验研究，并得出物理模型，以定义完全兼容的电气，光学和流体（或三模态）输入/输出和三模态通过晶圆互连的限制和机会。研究的总体战略是扩展和利用硅晶圆级批量制造技术，硅技术成功的关键，三峰互连网络的发展。拟议研究的智力价值是超越当前的硅辅助技术和思维，通过高风险和高回报的研究领域的互连技术的功率输送，高输入/输出带宽，散热，并使最紧凑，最高性能的三维千兆系统。这项高度跨学科的研究所产生的更广泛的影响将使半导体行业能够大大超过国际半导体技术路线图所预测的14纳米节点高性能芯片的散热、输入/输出带宽和功率传输指标（2020年）。输入/输出互连技术将基于简单和负担得起的制造工艺，从而使世界各地的研究人员和小公司能够使用它们。作为国家纳米技术基础设施网络计划的一个节点，我们计划让高中生和少数民族了解这项研究的结果，就像我们过去所做的那样，鼓励他们追求科学和工程

NSF Proposal 0701560M. Bakir & J. MeindlThe objective of this research is to develop the interconnect networks needed to enable a three-dimensional integrated gigascale system-on-a-chip. The approach is to perform experimental research and derive physical models to define the limits and opportunities of fully compatible electrical, optical, and fluidic (or trimodal) input/output and trimodal through-wafer interconnects. The overarching strategy of the research is to extend and utilize silicon wafer-level batch fabrication technology, the key to the success of silicon technology, to the development of the trimodal interconnect networks. The intellectual merit of the proposed research is to transcend current silicon ancillary technologies and thinking through high-risk and high-payoff research in the area of interconnect technologies for power delivery, high input/output bandwidth, and heat removal and to enable the most compact and highest performance three-dimensional gigascale system. The broader impact resulting from this highly-interdisciplinary research will be the enabling of the semiconductor industry to greatly exceed the heat removal, input/output bandwidth, and power delivery metrics for high performance chips at the 14 nm node (year 2020) as projected by the International Technology Roadmap for Semiconductors. The input/output interconnect technologies will be based on simple and affordable fabrication processes thereby making them accessible to a much wider range of researchers and small companies around the world. As a node within the National Nanotechnology Infrastructure Network program, we plan to bring and expose high-school students and minorities to results from this research as we have done in the past to encourage them to pursue science and engineering