SBIR Phase I: Low Dielectric Fiber for High Frequency Circuit Board Applications

小企业创新研究(SBIR)第一阶段项目将评估使用聚合物混合物制造高强度、低介电纤维作为高频电路板基板材料中玻璃纤维的增强材料的可行性。与FR-4电路板材料相比，这项创新将使高频电路板基板的介电常数降低42%(从5.2%降至3.0%)，介电损耗降低80%(从0.025降至0.005)。此外，板材的密度将降低35%，从而减轻移动和交通应用中的重量。虽然聚合物材料的混合物很常见，但为拟议的研究选择的聚合物材料尤其令人感兴趣，不仅是因为拟议的应用，而且还因为所选战略所固有的技术挑战。具体地说，这项研究建议混合可混溶的聚合物，其中一种是无定形的，另一种是半结晶的。虽然加工温度范围重叠，但纤维纺丝的高剪切环境应该提供有趣的科学和强烈的商业需求。如果成功，这些光纤将提供低成本、轻质的加固，在从高速计算到移动通信的各种应用中，可以为高频电路板材料提供显著的好处。

The Small Business Innovation Research (SBIR) Phase I project will assess the feasibility of using blends of polymers to make high strength, low dielectric fibers to be used as reinforcements with glass fiber in high frequency circuit board substrate materials. The innovation will allow a reduction in the dielectric constant of 42% (from 5.2 to 3.0) and dielectric loss of 80% (from 0.025 to 0.005) in high frequency circuit board substrates when compared to FR-4 circuit board materials. In addition, the density of the board materials will be decreased by 35%, lowering the weight in mobile and transportation applications. While blends of polymer materials are common, those chosen for the proposed research are particularly interesting not only for the proposed application, but also for the technical challenges inherent in the chosen strategy. Specifically, the research proposes to blend miscible polymers, one of which is amorphous and the other semi-crystalline. While the processing temperature ranges overlap, the high shear environment of fiber spinning should provide for interesting science as well as a strong commercial need. If successful, the fibers will provide for a low cost, light weight reinforcement which can provide significant benefit to high frequency circuit board materials in applications ranging from high speed computing to mobile communications.