SBIR Phase I: Repair and Manufacturing of Integrated Circuit Probe Cards through Innovations in Electrochemical Printing

这个小企业创新研究第一阶段项目是开发用于修复集成电路（IC）测试探针卡的电化学印刷技术。电化学印刷（EcP）将发展成为修复和制造探针卡上小批量高价值金属微结构的工具。EcP是一种无掩模固体自由曲面制造技术，在光栅微喷打印喷嘴下电沉积致密的金属微尺度图案。这项研究的更广泛的影响是为目前报废的探针卡提供一种经济的修复方法。

This Small Business Innovation Research Phase I Project is to develop Electrochemical Printing technology for the repair of integrated circuit (IC) test probe cards. Electrochemical Printing (EcP) will be developed as a tool for repairing and manufacturing small quantities of high value metal micro-structures on probe cards. EcP is a maskless solid freeform fabrication technique that electrodeposits dense metal micro-scale patterns beneath a rastering microjet print nozzle. The broader impact of this research is to provide an economical means of repair for probe cards that are currently scrapped.